Molecular dynamics simulation and properties of bisphenol A epoxy resin modified by alicyclic blending

Jiaxin Zhang,Cuiying Sun,Jie Liu,Lin Tian,Zhi-Ming Zhang,Boyan Jia,W. Wang,Xiongwei Zheng
DOI: https://doi.org/10.3233/jcm-226011
2022-03-25
Abstract:In order to improve the comprehensive properties of bisphenol A epoxy resin (DGEBA), the alicyclic epoxy resin blend was used to modify the DGEBA. The crosslinking model was established and the thermodynamic mechanism was analyzed by Molecular Dynamics (MD) simulation. The thermal, mechanical and electrical properties of the blend system were comprehensively analyzed through experiments. The research results show that when the introduction amount of alicyclic epoxy resin is between 10% and 20%, the thermal-mechanical-electrical comprehensive performance of the blending system reaches the best. Compared with bisphenol A epoxy resin, the glass transition temperature of the modified system is increased by 3.18%. The flexural strength and tensile strength are increased by 3.92% and 3.95%. The power frequency breakdown field strength is correspondingly increased by 7.16%, the leakage current is reduced by 6.11%, and the dielectric loss factor is reduced by 23.8%. Bisphenol A epoxy resin modified with alicyclic epoxy resin has excellent electrical application prospects.
Engineering,Materials Science,Computer Science
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