Abstract:This paper reviews the development of BMl resins and their applications, focusing on the main methods of molecular design modification and formulation optimization, including allyl, diamine, internal chain‐extended, and chemical/physical blending modification. With the development of communications technology, the copper‐clad laminate (CCL) for integrated circuits (IC) pointed to the direction of high‐frequency and high‐speed development, that is, a lower dielectric constant and dielectric loss requirements. Bismaleimide (BMI) resins feature stable dielectric properties and excellent thermal stability over a wide temperature range, widely used in the manufacture of high‐frequency and high‐speed CCL substrates. However, the comprehensive performance of BMI resin itself, including dielectric properties, still cannot fully meet the needs of the ever‐changing communications industry, so the molecular design modification of BMI resin to enhance the dielectric properties is currently one of the key research directions for integrated circuit CCL. This paper reviews the development of BMI resins and their applications, focusing on the main methods of molecular design modification and formulation optimization, including allyl, diamine, internal chain‐extended, and chemical/physical blending modification. Finally, the low dielectric BMI resin and its application and development in high‐frequency and high‐speed CCL are summarized and prospected. Future research directions include the design and synthesis of multi‐component copolymers to further realize the balance between low dielectric and comprehensive performance, as well as exploring the possibility of novel composite modifications to provide more competitive high‐performance materials for the IC laminate field. Highlights The development of bismaleimide resin and their applications are reviewed. Bismaleimide monomers' synthesis and chemical reaction are summarized. The modified methods of bismaleimide resin in low dielectric are reviewed. Future research directions of low dielectric bismaleimide are prospected.

High-performance bismaleimide resins with low cure temperature for resin transfer molding process

Curing behavior and properties of ultra-high temperature resistant RTM bismaleimide resin

Study on Curing Kinetics and Thermal Properties of Bismaleimide Resin Containing Ether Linkage

Bismaleimide resin modified with diallyl bisphenol A and diallyl p‐phenyl diamine for resin transfer molding

High-Performance Bismaleimide Resin with an Ultralow Coefficient of Thermal Expansion and High Thermostability

Optimization and preparation of an allyl phenoxy-modified bismaleimide resin

Preparation and Properties of High Performance Bismaleimide Resins Based on 1,3,4-Oxadiazole-containing Monomers

Synthesis and Properties of 1,3,4-Oxadiazole-containing High-Performance Bismaleimide Resins

Preparation and Characterization of Soluble Bismaleimide-Triazine Resins Based on Asymmetric Bismaleimide

Preparation and properties of bismaleimide resin blended with alkynyl-terminated modifiers

Molecular design and application of low dielectric bismaleimide resin

High Glass Transition Temperature Bismaleimide‐triazine Resins Based on Soluble Amorphous Bismaleimide Monomer

Preparation and Characterization of Bismaleimide-Resin-Based Composite Materials

Bio‐based hydroxymethylated eugenol modified bismaleimide resin and its high‐temperature composites

Vinyl-terminated butadiene acrylonitrile improves the toughness, processing window, and thermal stability of bismaleimide resin

Improved Melt Processabilities of Thermosetting Polyimide Matrix Resins for High Temperature Carbon Fiber Composite Applications

Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures

High Performance Thermosets from a Curable Diels–Alder Polymer Possessing Benzoxazine Groups in the Main Chain

Preparation And Characterization Of Novel Bismaleimide Resins Modified With Diallyl Bisphenol A

Design of high-performance resin by tuning cross-linked network topology to improve CF/bismaleimide composite compressive properties

Synthesis of novel bismaleimide monomers based on fluorene cardo moiety and ester bond: Characterization and thermal properties