Study on Curing Kinetics and Thermal Properties of Bismaleimide Resin Containing Ether Linkage

YAN Hong-qiang,WANG Hua-qing,CHENG Jie,FANG Zheng-ping
2011-01-01
Abstract:The cure reaction and thermal properties of bismaleimides containing ether linkage were characterized by methods of differential scanning calorimetry(DSC) and thermogravimetric analysis(TGA).It shows that the cure reaction and thermal properties of BMPN are obviously different from those of BMPB and BMPA because of the existence of naphthalene in the structure of bismaleimide(BMI) resin forming BMPN.The cure reactive activation of-C=C-group in the structure of BMPN is lower than those in the structures of BMPB and BMPA because of stronger electro-attracting ability of naphthalene ring in BMPN,and the activation energy for cure reaction of BMPN(117.7 kJ·mol-1) is higher than those of BMPB and BMPA.The thermal and thermal-oxidative stabilities of BMPN are ameliorated obviously due to the introduction of naphthalene ring in its BMI resin,and the introduced naphthalene ring plays a more important role towards the thermal-oxidative stability than the thermal stability.The existence of aromatic ring leads to reduce the rates of thermal and thermal-oxidative decompositions during high temperature stage.Compared to BMP resin,introduction of naphthalene ring remedies the loss of thermal and thermal-oxidative stability caused by the introduction of ether linkage.
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