Demonstration of a 5 Gb/s × 24 interchip optical interconnect system

Quanyou Feng,Xinzhu Sang,Wenhua Dou
DOI: https://doi.org/10.1002/mop.26754
IF: 1.311
2012-03-13
Microwave and Optical Technology Letters
Abstract:An 850 nm 12‐channel vertical cavity surface emitting laser array, a photodiode array, microprocessor chips, embedded fiber‐optic waveguides, and microlens optical coupling elements are integrated onto the printed circuit board. The bidirectional 5 Gb/s × 24 optical interconnect system is successfully demonstrated for interprocessor communication through optical I/O pins. © 2012 Wiley Periodicals, Inc. Microwave Opt Technol Lett 54:1176–1179, 2012
engineering, electrical & electronic,optics
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