Packaging Solution for a Millimeter-Wave System-on-Chip Radar

Benjamin Goettel,Wolfgang Winkler,Akanksha Bhutani,Florian Boes,Mario Pauli,Thomas Zwick
DOI: https://doi.org/10.1109/tcpmt.2017.2758725
2018-01-01
Abstract:In this paper, a packaging solution for millimeter-wave system-on-chip (SoC) radio transceivers is presented. The on-chip antennas are realized as primary radiators of an integrated lens antenna which offer high bandwidth and high efficiency. The package concept includes a high permittivity silicon lens which serves additionally as heat sink and a quad flat no-lead package which is mountable on a standard printed circuit board (PCB). The electrical and thermal properties of the package are investigated through simulations and calibrated measurements. The concept is verified by realizing a complete radar sensor. The manufactured SoC radar frontend is soldered on a standard PCB which includes the baseband circuitry for a frequency-modulated continuous wave radar and finally, measurements are performed to compare the superposed radiation patterns of the transmit and receive antennas with simulations.
engineering, manufacturing, electrical & electronic,materials science, multidisciplinary
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