Abstract:This communication presents a low-profile, wideband, and high-gain X-band low temperature cofired ceramics (LTCC) phased array antenna (PAA). The overall profile is only 2.4 mm that is around 0.12λ (λ is the free space wavelength at the highest working frequency) based on element sizes of 14.3 mm×18.2 mm (0.57λ×0.73λ) and a wide operating frequency bandwidth achieved by loading the matching vias between the patches of the dipole arms and the ground. The equivalent circuit model (ECM) of this element is given to comprehensively analyze the function of the matching vias to extend the impedance bandwidth. To further improve the scanning performance of the PAA, metal walls around the dipole patches and choke grooves on the substrate are introduced. Thus, the loop-mode resonance and surface waves that caused deterioration of the active voltage standing wave ratio (VSWR) near the lowest and highest operating frequencies are suppressed. To achieve higher gain, the proposed antenna element is compactly arranged with a larger distance (0.57λ×0.73λ) to construct an 8×8 array integrated in an LTCC package and the maximum gain at the highest frequency can reach 23.7 dBi. Moreover, the array can achieve a good beam scanning capability over a wide band of 40% with a maximum scanning angle up to ±45° (around 92.9% of the theory limit) in H-plane and ±20° (around 91.2% of the theory limit) in E-plane. Meanwhile, the active VSWRs almost always remain below 2.5, enabling perfect impedance matching when scanning at all angles. With these advantages, the proposed design has potential for application in satellite communication systems.

Broadband X -Band LTCC Front-End Prototype Integrated with Air Cavities Embedded Antenna-in-Package

Robustness‐oriented P‐band Phased Array Radar Front‐end with High Phase and Gain Resolution in 0.18 BiCMOS

A C-Band Compact High-Linearity Multibeam Phased-Array Receiver With Merged Gain-Programmable Phase Shifter Technique

Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar

A Low-Profile LTCC Phased Array Antenna with Wideband and High-Gain for X-Band Satellite Communication

A COMPACT X-BAND RECEIVER FRONT-END MODULE BASED ON LOW TEMPERATURE CO-FIRED CERAMIC TECHNOLOGY

Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

A Cost-Effective W-Band Antenna-in-Package Using IPD and PCB Technologies

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Design And Implementation Of A Compact Dual-Band Rf System-In-Package Module

A Laminated Wideband Dual Circularly Polarized Patch Antenna for X-Band Applications

Wideband PCB-Based Planar Array Antenna With High Aperture Efficiency Based on Substrate Integrated Gap Waveguide

LTCC Differential-Fed Broadband High-Gain and Narrow-Beam Planar Aperture Antenna for AiP Millimeter-Wave-Applications

A 1T2R Heterogeneously Integrated Phased-Array FMCW Radar Transceiver With AMC-Based Antenna in Package in the $W$-Band

Wideband Circularly Polarized Substrate Integrated Cavity-Backed Antenna Array

An X-band Fabry-Perot Cavity Antenna with Broadband and High-gain

A Broadband and Hign-Gain Aperture-Coupled Cavity Antenna Element for Array Application

A Wide-Band Low-Profile Antenna for a High-Integration Phased Array System

Axial ratio bandwidth enhancement of 60-GHz substrate integrated waveguide-fed circularly polarized LTCC antenna array

A Broadband D-Band Cavity-Backed Coupled-Feed Patch Antenna in Wafer-Level Package Based on Heterogeneous Integrations

A Fully Integrated X-Band Phased-Array Transceiver in 0.13-Μm CMOS Technology