Abstract:The hot deformation behaviors of single- and two-phase CuAlMn shape memory alloy were studied. Isothermal compression tests were conducted at different temperatures from 400<math>°C</math> to 800<math>°C</math> and various strain rates from 0.001/S to 1/S. At the temperature below 500<math>°C</math>, CuAlMn alloy had a two-phase microstructure (FCC <math>α</math> phase + <math>L21</math> <math>β</math> phase); while at the temperature higher than 550<math>°C</math>, the alloy had a single <math>β</math> phase structure. The flow stress curves showed the stress drop for all samples, indicating a dynamic recrystallization (DRX) feature of the alloy. The local minimum value of stress drop appeared at 500<math>°C</math>. The thermal active energy (<math>Q</math>) were calculated to be <math>418.7 kJ mol−1</math> for <math>α+β</math> alloy at 400–500<math>°C</math> and <math>219.7 kJ mol−1</math> for <math>β</math> alloy at 550–800<math>°C</math>, respectively. The artificial neural network (ANN) model showed a high precision to predict the flow stress of the studied alloy at a wide range of temperature. Based on the dynamic material model (DMM) theory, the processing map of the alloy that consists of the contour lines of the power dissipation factor, <math>η</math>, and the instability criteria was established. The grains were refined to a micron level and DRX of <math>α</math> phase occurred during the deformation between 400–500<math>°C</math> at the low strain rate. The hot deformation behaviors of the alloy at the low temperature (400–450<math>°C</math>) mainly depended on the deformation of <math>α</math> phase. The optimum deformation parameters for the single-phase CuAlMn alloys were 750–800<math>°C</math>/0.1–1 s−1.

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