DLP 3D Printing of High-Performance Epoxy Resin Via Dual Curing

Haohuan Wang,Zhengyong Huang,Jian Li,Licheng Li
DOI: https://doi.org/10.1109/iaecst54258.2021.9695694
2021-12-10
Abstract:The current DLP 3D printing resin is not comparable to those engineering resin. In this study, the hybrid of epoxy resin and 3D printing resin is prepared to achieve 3D printing of high-performance epoxy resin via dual curing. It has an optimum performance of two materials and great printing accuracy in 3D printing. It has low volume shrinkage of 9%, water uptake of 1%, less permittivity than 3.75, less dielectric loss than 0.06. Besides, its impact strength of 15 kJ/m2, the tensile strength of 77 MPa, and flexural strength of 92 MPa are much greater than the current DLP 3D printing resin. The high-performance 3D printing material has potential in the engineering field.
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