Hot isostatic diffusion bonding tungsten alloy and high-strength steel Part I: Design and preparation of Ni-Si-B interlayer by magnetron sputtering

Yue Wang,Jian Yang,Jihua Huang,Zhi Cheng,Wanli Wang,Shuhai Chen,Yue Zhao

DOI: https://doi.org/10.1016/j.jmapro.2018.08.024

IF: 5.684

2018-10-01

Journal of Manufacturing Processes

Abstract:Ni-Si-B interlayer film was deposited on 90WNiFe alloy substrate by magnetron sputtering. The thickness of Ni-Si-B film was measured and the macroscopic morphology was observed. The adhesive strength between film and substrate was determined, the microstructure and element distribution of the film, as well as the interface between film and substrate were researched. The research result indicates that, the film and substrate shows tight metallurgical combination, and the film exhibits the good integrality without any breakage. With increase of the sputtering time, the deposited film thickens gradually, the thickness of film d and sputtering time t meets the relationship of d = 0.33998 t+0.02583 t 2. However, with the increasing sputtering time, adhesive strength between film and substrate decreases gradually. For the films with sputtering times of 2 h and 6 h, there is no cracking under the scratch load of 100 N, while for those with sputtering times of 10 h, 16 h and 24 h, the affordable maximum scratch load decreases to 51.3 N, 34.6 N and 13.8 N, respectively. The element distribution of the film is uniform and the chemical composition is consistent with that of Ni-Si-B target well, which results in the similar melting points of film and target.

engineering, manufacturing