Overview of Resistive Random Access Memory (RRAM): Materials, Filament Mechanisms, Performance Optimization, and Prospects

Hong Wang,Xiaobing Yan
DOI: https://doi.org/10.1002/pssr.201900073
2019-05-28
Abstract:<p>Since conventional non‐volatile memory is limited by process technology and physical size, the resistive random access memory (RRAM) gradually enters the field of view due to its simple structure, fast program/erase speed, low power consumption and so on. This review paper summarizes the materials, filament mechanisms, performance optimization and application prospects of RRAM structures to guide the rational materials design. The filament mechanisms, which involve the electrochemical metallization mechanism (ECM), valence change mechanism (VCM) and thermochemical mechanism (TCM), of RRAM devices are particularly highlighted. In the meanwhile, the parameters which determine the RRAM characteristics are improved by incorporating three methods of the interface engineering, element doping of functional materials and introducing low‐dimensional materials, such as operating voltages, ON/OFF ratio, endurance, data retention etc. In the last section, a brief introduction to the future RRAM applications prospects and challenges is provided.</p>
physics, condensed matter, applied,materials science, multidisciplinary
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