Research on the thermal conductivity and dielectric properties of AlN and BN co-filled addition-cure liquid silicone rubber composites

Zhenzhen Ou,Feng Gao,Huaijun Zhao,Shumeng Dang,Lingjian Zhu
DOI: https://doi.org/10.1039/c9ra04771a
IF: 4.036
2019-01-01
RSC Advances
Abstract:The present work aims at studying the thermal and dielectric properties of addition-cure liquid silicone rubber (ALSR) matrix composites using boron nitride (BN) and aluminum nitride (AlN) as a hybrid thermal conductive filler.
chemistry, multidisciplinary
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