Spherical hybrid filler BN @ Al 2 O 3 via chemical adhesive for enhancing thermal conductivity and processability of silicon rubber

Shengwen Guan,Ziru Su,Feng Chen,Qiang Fu
DOI: https://doi.org/10.1002/app.51211
IF: 3
2021-06-03
Journal of Applied Polymer Science
Abstract:<p>Hexagonal boron nitride (h-BN) is an ideal candidate material for electrical and electronic systems due to its excellent performance. However, the addition of platelet-like h-BN leads to a dramatic increase of viscosity of composites and anisotropic thermal conductivity of composites. Herein, modified h-BN (m-BN) was coated onto spherical α-Al<sub>2</sub>O<sub>3</sub> via chemical adhesive, and core-shell structured hybrid spherical filler (m-BN@Al<sub>2</sub>O<sub>3</sub>) was prepared. Furthermore, the microstructure, rheology, mechanical properties, and thermal conductivity of hybrid filler/polydimethylsiloxane (PDMS) were studied. At 60 vol% filler loading, the thermal conductivity of m-BN@Al<sub>2</sub>O<sub>3</sub>/PDMS is up to 2.23 W·m<sup>−1</sup>·K<sup>−1</sup>, which is 86% higher than that of Al<sub>2</sub>O<sub>3</sub>/PDMS and the ratio of in-plane diffusivity to through-plane diffusivity decreases from 2.0 to 1.0. At meanwhile, the viscosity of m-BN@Al<sub>2</sub>O<sub>3</sub>/PDMS is about one fourth of the viscosity of m-BN/Al<sub>2</sub>O<sub>3</sub>/PDMS. This simple and versatile strategy opens a pavement for enhancing the thermal conductivity of polymer and has great potential in high-frequency communication.</p>
polymer science
What problem does this paper attempt to address?