Abstract:With the rapid development of modern electronic technology, addressing the heat dissipation problem of devices has become more and more urgent. Herein, the effects of molybdenum disulfide (MoS2) and hybrid hexagonal boron nitride (h-BN)/MoS2 fillers on the thermal conductivity of polydimethylsiloxane (PDMS) were investigated by reverse non-equilibrium molecular dynamics (RNEMD) simulation with fully atomistic model. Firstly, we simulated the thermal conductivity of MoS2 and BN fillers. It was found that the thermal conductivity of the two fillers enhanced with the increase of their sizes. The intrinsic thermal conductivity of MoS2 and BN obtained via the extrapolation were 52 W/(m·K) and 606 W/(m·K) separately. For 1-5 layers, the number of layers has almost no effect on the thermal conductivity of MoS2, but as the number of layers increase, the thermal conductivity of BN first decreases and then reaches a plateau. Then, we studied the thermal conductivity of the PDMS-based composites. Due to the existence of holes in the PDMS/MoS2 system, the thermal conductivity of PDMS/MoS2 composites is not much improved compared with that of PDMS. Therefore, we then introduced a hybrid BN/MoS2 filler into the composite to solve the void problem in the system. The results proved that this method was effective. The introduction of the hybrid BN/MoS2 filler effectively promoted the dispersion of the two fillers in the PDMS matrix and greatly reduced the holes in the composites. Compared with the composites filled with only one kind of filler, PDMS/BN/MoS2 composites possess better thermal conductivity. The most surprising finding is that there exists an optimal loading ratio of the two fillers, and the thermal conductivity of the composite reached the maximum when the mass ratio of the two fillers is approximately 1:1, attributed to the change of the volume fraction of holes(<math>Φ</math>). In addition, with the increase of hybrid BN/MoS2 filler content, the thermal conductivity of the composites is also increasing. The oscillating shear can also promote the orientation of the filler along the shear direction and improve the thermal conductivity of composites along that direction. Therefore, composites based on hybrid BN/MoS2 nano-fillers can be used to improve the thermal conductivity of insulating polymer materials. The findings should shed some light on the design and preparation of polymer composites with excellent thermal conductivity and electrical insulation properties.

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

Silver Nanoparticle-Enhanced Three-Dimensional Boron Nitride/Reduced Graphene Oxide Skeletons for Improving Thermal Conductivity of Polymer Composites

Silver Doped Boron Nitride Approach to Improve the Thermal Conductivity of Polyurethane Composites

Synergetic enhancement of thermal conductivity in the silica-coated boron nitride (SiO 2 @BN)/polymethyl methacrylate (PMMA) composites

Designing high thermal conductivity of polydimethylsiloxane filled with hybrid h-BN/MoS2 via molecular dynamics simulation

Enhanced Thermal Conductivity of Dielectric Polydimethylsiloxane Composites by Size-Controllable Boron Nitride Nanosheets

Construction of 3D boron nitride nanosheets/silver networks in epoxy-based composites with high thermal conductivity via in-situ sintering of silver nanoparticles

Facile fabrication of three-dimensional thermal conductive composites with synergistic effect of multidimensional fillers

A Novel 3D Sandwich Structure of Hybrid Graphite Nanosheets and Silver Nanowires As Fillers for Improved Thermal Conductivity

Enhanced thermal conduction of hybrid filler/polydimethylsiloxane composites via a continuous spatial confining process

High-Performance Polyimide Nanocomposites with Core-Shell Agnws@Bn for Electronic Packagings

Multi‐contact Hybrid Thermal Conductive Filler Al2O3@AgNPs Optimized Three‐dimensional Thermal Network for Flexible Thermal Interface Materials

Construction of three-dimensional interconnected boron nitride/sliver networks within epoxy composites for enhanced thermal conductivity

Multi‐contact hybrid thermal conductive filler Al 2 O 3 @ AgNPs optimized three‐dimensional thermal network for flexible thermal interface materials

Enhancing Thermal Conductivity of Silicone Rubber Via Constructing Hybrid Spherical Boron Nitride Thermal Network

Synchronously Improved Thermal Conductivity and Mechanical Property for Polybenzimidazole Composites by Building the Ternary Hybrid Nanofillers Networks

Achieving a 3D Thermally Conductive while Electrically Insulating Network in Polybenzoxazine with a Novel Hybrid Filler Composed of Boron Nitride and Carbon Nanotubes

Study on thermal conductive PA6 composites with 3-dimensional structured boron nitride hybrids

Largely improved thermal conductivity of PI/BNNS nanocomposites obtained by constructing a 3D BNNS network and filling it with AgNW as the thermally conductive bridges

Enhanced Thermal Conductivity of Silicone Rubber Via Synergistic Effects of Polydopamine Modification and Silver Deposition on Boron Nitride

Improved thermal conductivity of epoxy composites via linked boron nitride nanosheets with in-situ generated silver nanoparticles