Abstract:With the rapid development of modern electronic technology, addressing the heat dissipation problem of devices has become more and more urgent. Herein, the effects of molybdenum disulfide (MoS2) and hybrid hexagonal boron nitride (h-BN)/MoS2 fillers on the thermal conductivity of polydimethylsiloxane (PDMS) were investigated by reverse non-equilibrium molecular dynamics (RNEMD) simulation with fully atomistic model. Firstly, we simulated the thermal conductivity of MoS2 and BN fillers. It was found that the thermal conductivity of the two fillers enhanced with the increase of their sizes. The intrinsic thermal conductivity of MoS2 and BN obtained via the extrapolation were 52 W/(m·K) and 606 W/(m·K) separately. For 1-5 layers, the number of layers has almost no effect on the thermal conductivity of MoS2, but as the number of layers increase, the thermal conductivity of BN first decreases and then reaches a plateau. Then, we studied the thermal conductivity of the PDMS-based composites. Due to the existence of holes in the PDMS/MoS2 system, the thermal conductivity of PDMS/MoS2 composites is not much improved compared with that of PDMS. Therefore, we then introduced a hybrid BN/MoS2 filler into the composite to solve the void problem in the system. The results proved that this method was effective. The introduction of the hybrid BN/MoS2 filler effectively promoted the dispersion of the two fillers in the PDMS matrix and greatly reduced the holes in the composites. Compared with the composites filled with only one kind of filler, PDMS/BN/MoS2 composites possess better thermal conductivity. The most surprising finding is that there exists an optimal loading ratio of the two fillers, and the thermal conductivity of the composite reached the maximum when the mass ratio of the two fillers is approximately 1:1, attributed to the change of the volume fraction of holes(<math>Φ</math>). In addition, with the increase of hybrid BN/MoS2 filler content, the thermal conductivity of the composites is also increasing. The oscillating shear can also promote the orientation of the filler along the shear direction and improve the thermal conductivity of composites along that direction. Therefore, composites based on hybrid BN/MoS2 nano-fillers can be used to improve the thermal conductivity of insulating polymer materials. The findings should shed some light on the design and preparation of polymer composites with excellent thermal conductivity and electrical insulation properties.

In-situ fabrication of hetero-structured fillers to significantly enhance thermal conductivities of silicone rubber composite films

Simultaneously enhance thermal conductive property and mechanical properties of silicon rubber composites by introducing ultrafine Al2O3 nanospheres prepared via thermal plasma

Flexible thermally conductive and electrically insulating silicone rubber composite films with BNNS@Al2O3 fillers

Effect of Micro-Si3n4-Nano-Al2o3 Co-Filled Particles on Thermal Conductivity, Dielectric and Mechanical Properties of Silicone Rubber Composites

Spherical hybrid filler BN @ Al 2 O 3 via chemical adhesive for enhancing thermal conductivity and processability of silicon rubber

Processing, thermal conductivity and flame retardant properties of silicone rubber filled with different geometries of thermally conductive fillers: A comparative study

Electrical Properties of High Thermal Conductivity Inorganic Fillers/silicone Rubber Composites

Effect of hydroxylated boron nitride and boron nitride nanosheets on the properties of doped organosilicone rubber composites

A Novel Branched Al2O3/Silicon Rubber Composite with Improved Thermal Conductivity and Excellent Electrical Insulation Performance

Designing high thermal conductivity of polydimethylsiloxane filled with hybrid h-BN/MoS2 via molecular dynamics simulation

Preparation of branched Al 2 O 3 and its synergistic effect with carbon nanotubes on the enhancement of thermal conductive and electrical insulation properties of silicone rubber composites

Enhanced Thermal Conductivity by Combined Fillers in Polymer Composites

Enhancing thermal conductivity of spherical boron nitride/silicone rubber composites by matching interfacial modulus

Thermal, electrical, and mechanical properties of addition-type liquid silicone rubber co-filled with Al<sub>2</sub>O<sub>3</sub> particles and BN sheets

Preparation of continuous carbon fiber‐filled silicone rubber with high thermal conductivity through wrapping

Low dielectric permittivity and high thermal conductivity silicone rubber composites with micro-nano-sized particles

Thermally conductive silicone rubber used as insulation coating through incremental curing and the effects of thermal filler on its mechanical and thermal properties

Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets

The Effect of Various Fillers on the Properties of Methyl Vinyl Silicone Rubber

Highly thermally conductive polymer-based composites with 3D exfoliated BNNS/functionalized SiC networks prepared by rapid solidification and hot pressing