Simulation on vertical microchannel evaporator for rack-backdoor cooling of data center

Binfei Zhan,Shuangquan Shao,Hainan Zhang,Changqing Tian
DOI: https://doi.org/10.1016/j.applthermaleng.2019.114550
IF: 6.4
2020-01-01
Applied Thermal Engineering
Abstract:The rack-backdoor cooling technology used with a vertical microchannel evaporator of a loop thermosyphon system has a great application prospect in data center cooling. Thus, investigating the evaporator's performance is necessary especially under inhomogeneous air-side conditions according to the actual operation scenarios of the rack. This study establishes a multiple heat source physical model of a 42U rack and the mathematical models of rack cooling on the basis of actual products. The entire heat transfer and temperature distribution are verified. After being heated by servers and before entering an evaporator, inhomogeneous air temperature and flow velocity data can be obtained with the physical rack model. The maximum difference is up to 6 °C and 0.6 m/s. The air temperature on top is 0.6 °C higher than that at the bottom of inside the rack due to the thermal lift in the vertical direction. The mathematical model indicates that the maximum difference of the refrigerant vapor quality among vertical tube outlets can reach 0.14, whereas the maximum air-side temperature difference of the evaporator outlet is 9.5 °C. These simulation results can provide effective guidance for the optimization design and application of vertical microchannel evaporators.
energy & fuels,engineering, mechanical,thermodynamics,mechanics
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