Effect of interfacial intermetallic compounds evolution on the mechanical response and fracture of layered Ti/Cu/Ti clad materials

Yong Keun Kim,Hesam Pouraliakbar,Sun Ig Hong
DOI: https://doi.org/10.1016/j.msea.2019.138802
2020-01-01
Abstract:<p>Three-layered Ti/Cu/Ti clad materials fabricated by cold roll-bonding process and in the following underwent heat treatment cycles. Microstructure evolution and mechanical properties of as-rolled and annealed samples studied by SEM, XRD, microhardness and tensile examinations. According to the results, as-rolled and treated samples contained several IMCs at their Ti/Cu interfaces while thickness of the reaction layer enhanced noticeably by annealing. Examined average IMC layers' thickness were 1.34, 1.61, 2.39 and 5.39 μm, for as-rolled, 300, 500 and 700 °C annealed specimens, respectively, consisting four different phases of CuTi<sub>2</sub>, CuTi, Cu<sub>3</sub>Ti<sub>2</sub>, and Cu<sub>4</sub>Ti. However, continuity, uniformity and thickness variation as well as the growth rate during treating for each layer was distinct. From SEM and XRD results that acquired from separated surfaces, major debonding occurred at CuTi<sub>2</sub>/CuTi and CuTi/Cu<sub>3</sub>Ti<sub>2</sub> interfaces suggesting that bonding strength for these IMC layers were weaker than those for the other IMC/IMC interfaces and the parent-metal/IMCs. The stress-strain curves demonstrated that the strength decreased and subsequently ductility improved by annealing up to 700 °C. Meanwhile, SEM analyses revealed that cracks within IMC layers during tensile deformation emerged only in specimen annealed at 700 °C; however, it did not lead debonding or layer separation similar to other clad metals reported in literature. By fractography, it is indicated that dimples formed in the whole fracture surface of as-rolled and annealed specimens at 300 and 500 °C. For the 700 °C annealed specimen, however fracture mode was ductile, dimples hardly noticed since the cracks propagation and extension path was along the weak IMC interfaces. In addition, this sample unlike others exhibited limited necking extension before failure. According to the obtained results and as the current research's novelty, it is claimable that intermetallics formed in Ti/Cu clad materials would be more ductile comparing with other compounds reported for talented cladding metals in literature.</p>
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