Warpage analysis and optimization of thin-walled injection molding parts based on numerical simulation and orthogonal experiment

Yanfang Chen,Junjie Zhu
DOI: https://doi.org/10.1088/1757-899x/688/3/033027
2019-11-01
IOP Conference Series: Materials Science and Engineering
Abstract:Abstract With the warpage of a mobile phone case as the index, a numerical model for injection molding was established by CAE software. The process parameters of 5 factors including injection time, mold temperature, melt temperature, packing time and packing pressure were analyzed by orthogonal experiment, the effect of injection process parameters on warpage was studied and the minimum combination of process parameters was obtained. The simulation results show that the warpage was reduced by 6.98% after optimization, and higher quality plastic parts were obtained, which has important guiding significance for the production practice of thin-wall parts.
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