Additive Behavior in Cu Electroplating and the Recrystallization of Plated Cu

Qiang Huang,Brett Baker-O'Neal,James Kelly,Cyril Cabral

DOI: https://doi.org/10.1149/ma2011-02/28/1932

2011-08-01

ECS Meeting Abstracts

Abstract:Abstract not Available.

What problem does this paper attempt to address?

Simulation of TSV Copper Electrodeposition Process with Additives

Wei Luo,Haiyong Cao,Liming Gao,Ming Li

DOI: https://doi.org/10.1109/icept.2013.6756517

2013-01-01

Abstract:The kinetics which explained the Copper Super-filling by electrodepostition was investigated since the copper deposition became the standard technique for TSV. A simple numerical model is built to explain the copper deposition process. Consider with the effect of the accelerator, a linear equation is built to explain the relationship between the exchange current density and the coverage of accelerator as well as the relationship of the potential and the coverage of accelerator. The parameter of the equation is investigated in the article. The results show that the linear equation indicates process of copper electrodeposition sufficiently with properly parameters.
Electrochemical Analysis of Cathode in TSV Copper Electroplating

Haiyong Cao,Xue Feng,Qi Sun,Wei Luo,Huiqin Ling,Jiangyan Sun,Ming Li

DOI: https://doi.org/10.1109/icsj.2012.6523399

2012-01-01

Abstract:In TSV copper electroplating, the most important is to form the “bottom up” deposition. In order to achieve this kind of super-filling, additive in the electroplating bath need to play its own role at the respective position. Accelerator adsorb at the bottom of the via to accelerate the deposition of copper while suppressor mostly adsorb at the top of the via to inhibit the deposition. Therefore, vias could be supper-filled without any void. In this paper, bis(3-sulfopropyl) disulfide (SPS) and polyethylene glycol (PEG) were used as accelerator and suppressor respectively. The supper-filling mechanism and the competitive adsorption of SPS and PEG were being researched by means of linear sweep voltammetry (LSV) and cyclic voltammogram (CV). The electrochemical analysis and the experimental plating are closely related.
A novel bright additive for copper electroplating: electrochemical and theoretical study

DOI: https://doi.org/10.1007/s11581-022-04799-7

IF: 2.961

2022-11-05

Ionics

Abstract:In order to fabricate copper coatings with excellent brightness, a cationic additive was screened by applying the electrochemical method and the theoretical calculation method. The adsorption-coordination coupling inhibition mechanism was proposed to illustrate the influence of the additive methylene blue (MB). The electrochemical behavior of copper electrodeposition influenced by MB was investigated by cyclic voltammetry and chronoamperometry. The copper electrodeposition under the influence of MB is diffusion-controlled, while the nucleation and growth of coating are 3D diffusion-controlled instantaneous nucleation processes. The electroplating process was optimized and bright copper coating can be obtained at wide range of current density according to SEM analysis and AFM analysis. The XRD was used to study the phase structure under the influence of current density and (1 1 1) surface is obtained preferentially with the increase of current density. The mean grain size is within 100 nm according to Scherrer's formula, illustrating that nanocrystalline copper coating is obtained.

chemistry, physical,physics, condensed matter,electrochemistry
Initial surface roughness of electrochemical plating copper under different conditions

Qingqing Sun,Lian Zhu,Hongliang Lü,Shijin Ding,Davidwei Zhang,LiKang Wang

2006-01-01

Abstract:The uniformity and morphology during electrochemical plating of copper film is extremely important in Copper interconnect processing. However, the uniformity and morphology of plated copper film can be strongly influenced by process conditions. It is well known that additives in copper plating bath is believed to be a key to achieve bottom-up filling. For copper plating in the trench and via with smaller size, the initial surface roughness is an important factor that links to the elimination of void in copper film. Initial surface roughness should be reduced in order to prevent impinging caused by surface roughness in small feature. In this paper, we complete a set of experiments to investigate the relationship between surface roughness and additives in copper plating bath. A simple model is developed to explain the relationship between initial roughness and additives, and Chronoamperometry curves derived from electrochemical workstation are measured to confirm the rationality of the simple model.
TSV Cu Plating and Implications for CMP

Aleksandar Radisic,Harold Philipsen,Mia Honore,Yu-Shuen Wang,Nancy Heylen,Zaid El-Mekki,Silvia Armini,Kevin Vandersmissen,Simon Rodet,Annemie Van Ammel,Hugo Bender,Christel Drijbooms,Kris Vanstreels,Wouter Ruythooren

DOI: https://doi.org/10.1149/1.3575437

2011-04-25

ECS Transactions

Abstract:In the work presented here, we focused on fabrication of Cu nails for 3D Stacked-Integrated-Circuits (3D-SIC) applications using electrochemical deposition from the bath with model ('open source') additives. We have studied the effects of bath composition on the Cu fill profile and overburden, and have also examined the correlations between phenomena observed during post-plating-processing and bath composition. Based on these results, we explored different approaches to improving Cu removal rate during Chemical Mechanical Polishing (CMP).

English Else
Study on Cu-Sn Alloy Electrodeposition

Haruo INAGAKI

DOI: https://doi.org/10.4139/sfj1950.9.338

1958-01-01

Journal of the Metal Finishing Society of Japan

Abstract:Experiments on electroplating of Cu-Sn alloys under various conditions were carried out in the plating solution composing mainly of copper cyanide and sodium stanate, of which five kinds were used varying the ratio of Cu/Sn from 7/10 to 16/1.The results of X-ray diffraction examination are as follows:1. Sn content in the electrodeposited Cu-Sn alloys varies from 10 to 78%. Phases in the alloys are classified into four groups, namely, (a) α only, (b) α+η, (c) η only, and (d) θ+ξ.2. In the electrodeposited alloys, the phase of (η+ζ), which exists in the equilibrium phase diagram of Cu-Sn alloy, can not be seen, and the region of this phase is displaced by η and (θ+ξ) phases.3. β, δ, and ε phases, which exist in the phase diagram at high temperature, also can not be seen in the deposited alloy.4. In the electroplated alloy of speculum plating, only (α+η) or η phase is crystallized and the number of diffraction patterns in this case is significantly small as compared with that in the other cases.5. The composition of the deposited alloy is decided mostly depending upon the composition of plating solution, but not mach upon other plating conditions such as current density, stirring, etc.
Corrosion Behaviour of Cu-Sn-Zn Ternary Alloy Electrodeposited via Less Hazardous Electrolyte

DOI: https://doi.org/10.55057/ijbtm.2023.5.s5.8

2023-12-01

International Journal of Business and Technology Management

Abstract:Electroplating is a process that produces a metal coating on a solid substrate through the reduction of cations using a direct electric current. The reasons for plating vary from decorative and aesthetic purposes to enhance coating properties and improve the corrosion rate of the metal. Currently, there are not many finishing techniques that serve the purposes of various functional applications and aesthetic appeal. Thus, the electroplating process stands out as one of those surface finishing techniques that can impact peculiar properties. This procedure transfers the desired metal coating from an anode to a cathode, which is the part to be plated. In this project, a carbon substrate acts as the cathode, while a copper sheet functions as the anode. A non-cyanide solution that is environmentally friendly is developed to produce a Cu-Sn-Zn alloy. The project aims to prepare Cu-Zn-Sn alloys by the electroplating process. Overall, the results show that the best current density and time used for electroplating are 0.7 Acm-2 and 30 minutes, respectively.
Effects of Fe(III) and Cu(I) on Electrodeposition and Microstructure Characterization for Acid Plating Bath

Jing Xiang,Yingjie Wang,Chong Zeng,Yonggang Xu,Wenyao Yang,LiangLiang Tian,Haibo Ruan,Qiang Yang

DOI: https://doi.org/10.1007/s12678-022-00743-5

2022-06-30

Electrocatalysis

Abstract:Electrodeposited copper is a very critical technology for 3D interconnection structure to ensure the stability of signal transmission in IC package substrate. However, Cu(I) produces during long-term electrodeposition and has an obvious adverse effect on the surface microstructure and brightness of electrodeposited copper. In this paper, Fe(III) was introduced into the electrodeposited copper system to solve the negative effect of Cu(I) on the electrodeposited copper layer and improve the surface performance of copper layer. The galvanostatic measurement (GM), cyclic voltammetry (CV), electrochemical impedance spectroscopy (EIS), and polarization curves were used to explore the effect of Cu(I) and Fe(III) on the electrochemical behaviors of the electrolyte system. Simultaneously, the surface microscopic characterization and brightness of the copper layers were observed by scanning electron microscope (SEM), camera, diffraction of x-rays (XRD), and 3D confocal laser microscope (3D-CLM). Finally, the results showed that Fe(III) improved the surface microstructure, recovered brightness of copper layer, and restored the ratio of the copper crystal planes (200) and (220).

chemistry, physical,electrochemistry
Copper Electroplating with Polyethylene Glycol: Part II. Experimental Analysis and Determination of Model Parameters

H. Yang,R. Krause,C. Scheunert,R. Liske,B. Uhlig,A. Preusse,A. Dianat,M. Bobeth,Gianaurelio Cuniberti

DOI: https://doi.org/10.1149/2.0081802jes

IF: 3.9

2018-01-01

Journal of The Electrochemical Society

Abstract:In the electrochemical deposition of copper on structured substrates, additives are commonly used as ingredients to refine the copper thin film properties. By means of cyclovoltametric (CV) measurements, we examine the process behavior of the additives PEG (polyethylene glycol) and chloride ions over a wide range of experimental parameters relevant for production-like conditions. In this plating process, additives practically are neither consumed in chemical reactions nor are they incorporated into the growing copper film. To understand the observed complex hysteresis behavior of the deposition current in CV scans, we have recently proposed a model which is able to qualitatively explain this behavior without supposing additive consumption. In the present study, we fit crucial parameters of this model from the experimental data to increase its predictive power. The quantitative agreement of performed simulations of CV scans with the measured scans demonstrates the validity of the proposed copper deposition model. Equipped with the determined parameter set, the model can help to optimize the copper plating process in industrial applications.

electrochemistry,materials science, coatings & films
Electroless Plating of Copper on Al2o3 and Its Heat Treatment Behaviour

Z. -L. Lu,Z. -C. Wang,L. -M. Luo,X. -M. Huang,X. -Y. Tan,J. -B. Chen,J. -G. Cheng,Y. -C. Wu

DOI: https://doi.org/10.1179/1743294414y.0000000387

IF: 2.451

2015-01-01

Surface Engineering

Abstract:Electroless copper plating on Al2O3 substrate assisted by a new non-noble pretreatment is developed, the surface exhibits granular distribution, and the particles are closely bound except for the presence of defects (large holes). Heat treatment is performed at various temperatures to modify this surface. Results show that slight surface changes occur when the heat treatment temperature is below the recrystallisation temperature. Beyond the recrystallisation temperature, particles are fused, thereby modifying certain properties. However, heat stress also increases with increased temperature to 800°C, leading to poor bonding between the plating and substrate. When the temperature approaches the melting point of copper, plating exhibits an entirely different surface morphology. The molten copper in the cooling process forms shrinkages and dimples that reduce coating performance. The optimal heat treatment temperature is deemed to be approximately 500°C.
Study on the Behavior of Zn–Fe Alloy Electroplating

Z Zhang,WH Leng,HB Shao,JQ Zhang,JM Wang,CN Cao

DOI: https://doi.org/10.1016/s0022-0728(01)00665-9

IF: 4.598

2001-01-01

Journal of Electroanalytical Chemistry

Abstract:The electroplating behavior of Zn, Fe and Zn–Fe alloy onto copper from light acid chloride solutions (LACS, pH 3.07 containing H3BO3, Na2C6H5O7·2H2O and different amounts of Zn2+ and Fe2+) was investigated by means of cyclic voltammetry and the steady-state polarization technique. It was found that, in the experimental conditions, during the Zn–Fe alloy formation no underpotential deposition (upd) was observed, and the deposition of Zn–Fe followed the mechanism of three-dimensional (3-D) nucleation and subsequent grain growth. The Zn2+ ions in the electrolyte inhibit the deposition of Fe, while Fe2+ ions promote the deposition of Zn. It was also found experimentally that the co-deposition of Zn and Fe behaved anomalously, and the result was interpreted theoretically in the light of quantum chemistry.
Electrochemical behaviors of additives in high Cu(II) concentration solution for high-aspect-ratio through ceramic holes filling

Qing Wang,Yun Mou,Jiaxin Liu,Yang Peng,Mingxiang Chen

DOI: https://doi.org/10.1016/j.mtcomm.2021.102747

IF: 3.8

2021-12-01

Materials Today Communications

Abstract:The electrochemical behavior of additives determinates the filling process of through ceramic holes (TCHs), which is severely affected by Cu(II) concentration in the virgin make-up solution (VMS). High concentrations of Cu(II) are rarely reported in through-holes (THs) filling owing to its insufficient throwing power. High concentration CuSO4 (0.7 M) and low concentration H2SO4 (0.61 M) were confirmed as VMS, and thiazolinyl polydipropyl sulfonate (SH110), polyethylene glycol (PEG), and nitrotetrazolium blue chloride (NBT) were chosen as the accelerator, suppressor, and leveler, respectively. The electroplating performances were investigated under different plating solutions. The electrochemical behavior of additives and their combinations were evaluated by galvanostatic and cyclic voltammetric measurements. The filling performance of PEG-SH110-NBT in high Cu(II) solution is affected by convection. Plating efficiency is effectively improved by SH110 in the designed high Cu(II) plating solution. PEG and NBT have a synergistic effect on inhibition, while NBT shows a leveling effect only in the presence of SH110. The plating solution with a low air agitation flow rate effectively promotes the high-quality filling of TCHs with a high aspect ratio (AR) of 5, 4.75, and 3.8. The filled TCHs display mirror-bright surface and grain refinement without the void defects.

materials science, multidisciplinary
Combined fluid flow simulation with electrochemical measurement for mechanism investigation of high-rate Cu pattern electroplating

Qing Wang,Zhe Wang,Yongtong Wang,Yao Tong,Mingxiang Chen

DOI: https://doi.org/10.1016/j.jtice.2022.104528

IF: 5.477

2022-09-27

Journal of the Taiwan Institute of Chemical Engineers

Abstract:Highlights • The convection in the Cu pattern surface increase with the Cu layer thickness. • The mechanism of Cu layer improvement under high current density was explained. • The adsorption model of the convection-dependent additives during the high current density Cu pattern electroplating process was proposed. • The Cu pattern with excellent properties was electroplated under a current density of 8 ASD with an ultra-high rate of over 90 μm/h. Background Cu pattern electroplating plays an essential role in the interconnection and microstructure fabrication of high-power device packaging. However, improving efficiency while ensuring the preparation quality is an urgent breakthrough direction. Methods A new electrolyte formula suitable for the high-rate Cu pattern electroplating was put forward, including 300 mg/L polyethylene glycol (PEG, molecular weight=8000) and 6 mg/L thiazolinyl polydipropyl sulfonate (SH110). The mechanism of high-rate Cu pattern electroplating was investigated by the combination of fluid flow simulation and the electrochemical measurements including galvanostatic measurements (GMs) and cyclic voltametric (CV) tests. The Cu pattern was electroplated in the Haring-Cell with air bubble as the forced convection method. Significant findings The simulation results indicate that the flow rate on the ring-shaped cathodic pattern surface gradually increases with the Cu growing up, which also increase from the pattern surface to the bulk electrolyte. The GMs results suggest that the cathodic polarization of the convection-dependent additives raises with the current density, which is strengthened by strong convection with current density lower than 6 ASD but have the opposite effect with current density larger than 8 ASD. The CV tests indicating that the aggregation of weak convection and strong polarization promote the antagonistic effect between thiolate of SH110 and PEG, the nucleation and the electroplating rate. Nevertheless, the synergistic effect of thiazoline of SH110 and PEG are enhanced with strong convection and weak polarization. The adsorption model during the Cu pattern electroplating process is established and verified by electroplating experiment with the optimum current density of 8 ASD. The Cu pattern is mirror bright with the high electroplating rate of over 90 μm/h. Graphical abstract Download : Download high-res image (160KB) Download : Download full-size image

engineering, chemical
Simulation of Shape Evolution during Electrodeposition of Copper in the Presence of Additive

M. Georgiadou,D. Veyret,R. L. Sani,R. C. Alkire

DOI: https://doi.org/10.1149/1.1344540

IF: 3.9

2001-01-01

Journal of The Electrochemical Society

Abstract:Shape evolution during electrodeposition of copper in microtrenches was studied numerically by a model which incorporates adaptive meshing capabilities. Filling of trenches with copper without creating a void was related to plating additives in solution. The shape-change behavior of this system resulting from variation of the feature’s aspect ratio, bulk composition, and level of additive components was investigated. The operating window of bath conditions for void-free electrodeposition was studied in the range of 0.25×10−4 to 10−4M bulk concentration of additive in a 0.25 M CuSO4+0.2MH2SO4 plating solution and for aspect ratios (depth:width) from 0.5 to 4. The mathematical model includes fluid flow, transport by diffusion, migration and convection, multiple species, and reactions in complex geometries. © 2000 The Electrochemical Society. All rights reserved.

electrochemistry,materials science, coatings & films
Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N -octylpyridinium bromide: Experimental and computational studies

Aliaksandr A. Kasach,Anton Kasprzhitskii,Dzmitry S. Kharytonau,Andrei V. Pospelau,Irina I. Kurilo,Georgy Lazorenko

DOI: https://doi.org/10.1016/j.colsurfa.2024.133321

IF: 5.518

2024-02-02

Colloids and Surfaces A Physicochemical and Engineering Aspects

Abstract:Galvanic deposition of copper, tin and their alloys is widely used in microelectronics, printed circuit boards, anticorrosive and decorative finishing of products for various purposes. One of the main factors determining the structural and morphological characteristics of the deposited coatings is the value of cathodic polarization during the deposition, which depends on the presence of complexing ions and surfactants. Complexation is one of the most effective and widespread ways to increase the cathodic polarization, as well as the convergence of deposition potentials of copper and tin. In this work we studied the combined effect of thiourea and N -octylpyridinium bromide additives on the kinetics of Cu, Sn, and Cu-Sn electrocrystallization from sulfuric acid electrolytes. The combined presence of these additives allows obtaining homogeneous and fine-grained Cu-Sn coatings. The results of theoretical studies agree well with experimental data and show that the introduction of thiourea and N-octylpyridinium bromide leads to the inhibition of cathodic reduction of hydrated copper(II) and tin(II) ions.

chemistry, physical
In Situ Study of Copper Electrodeposition on A Single Carbon Fiber

Shuangqi Song,Christopher M. Ortega,Zhu Liu,Jun Du,Xiaoshan Wu,Zhonghou Cai,Li Sun

DOI: https://doi.org/10.1016/j.jelechem.2012.12.005

IF: 4.598

2013-01-01

Journal of Electroanalytical Chemistry

Abstract:Copper metallization on carbon surface can improve physicochemical performances of carbon based materials and introduce multi-functionalities. This paper reports on the combined electrochemical characterization, in situ X-ray diffraction and fluorescence research, and scanning electron microscopic studies of nucleation and growth of Cu on individual carbon fibers. Compared to the flat glassy carbon substrates and Au thin film substrates, the onset potential of Cu electrodeposition on individual carbon microfiber is more negative with lower efficiencies, indicating the difficulty of Cu nucleation on carbon fiber surface. Utilizing the capability of synchrotron X-ray microbeam diffraction and fluorescence spectroscopy techniques, real time Cu crystalline structure and composition evolvement information during the electrochemical reaction processes have been studied. In situ study reveals random Cu grain formation and anisotropic growth. Dynamic Cu growth and dissolution were found to occur simultaneously during deposition. Cu nuclei density and size can be effectively controlled, in addition to the grain morphology and stability, indicating the possibility of electrochemical manipulation of microstructure thus the properties of Cu coated carbon materials. (C) 2012 Elsevier B.V. All rights reserved.
Observation of the Behavior of Additives in Copper Electroplating Using a Microfluidic Device

Takanori Akita,Mineyoshi Tomie,Ryo Ikuta,Haruki Egoshi,Masanori Hayase

DOI: https://doi.org/10.1149/2.0081901jes

IF: 3.9

2018-10-31

Journal of The Electrochemical Society

Abstract:The suppression behavior of copper electrodeposition by additives was studied using a microfluidic device. Strong suppression and its cessation due to additive adsorption and deactivation on the plating surface is believed to be crucial for copper bottom-up TSV (Through Silicon Via) filling. Monitoring of additive deactivation is not easy, however, because adsorption generally co-exists with deactivation in the usual experimental environment. In the present study a micro working electrode was prepared on a microchannel wall and electrodeposition was performed, with in-situ microscopic observation. During the electroplating, the supply of the additive was interrupted by switching of the plating solution in the microfluidic device, and deactivation of the additive was observed directly. Three typical suppressing additives were examined; a commercial leveler, which enabled extreme bottom-up, yielded the most rapid deactivation, whereas PEG (Polyethylene Glycol) maintained suppression for a long time after the additive supply had stopped. Optical microscope images revealed the growth of many protrusions after the leveler supply had been interrupted. Moderate agreement between the experimental results and numerical simulations was found, and the additive adsorption-deactivation parameters, kp and km, were estimated.

electrochemistry,materials science, coatings & films
Investigation of benzoquinone as a new type of Cu electroplating additive

Li Zheng,Chong Wang,Jing Li,Yuanming Chen,Yongqiang Li,Yongqiang Peng,Dingjun Xiao,Ze Tan,Wei He

DOI: https://doi.org/10.1109/impact.2017.8255907

2017-10-01

Abstract:It is becoming more and more difficult to achieve the conformal electroplating of through-holes (THs) and superfilling of micro-vias with the increasing number of layers of high-density interconnect (HDI) printed circuit board (PCB). Therefore, organic additives as the one of the most convenient methods to accomplish uniform plating, obviously play an important role in electroplating Cu. In this paper, benzoquinone as a new type of additive was investigated in order to reduce the copper thickness of the surface. According to the cyclic voltammetry (CV) test and galvanostatic measurements (GMs), it is confirmed that the principle was competitive reduction reaction of benzoquinone and Cu2+ when benzoquinone injected into the electroplating solution. Besides, the results of GMs and cyclic voltammetry stripping (CVS) also indicated that the effect of benzoquinone on the surface and the center of THs is different due to the difference in mass transfer between the surface and center. Furthermore, the Haring cell tests was conducted in order to figure out the thickness of surface THs. Through calculation, compared to none of benzoquinone, the thickness of surface reduced $4.3\ \mu\text{m}$. Thus, it can be concluded that the benzoquinone was a new type of additive which aimed to reduce the Cu thickness of surface and it can achieve conformal electroplating together with brightener, inhibitors, levelers in further application.
Effect of Additives on Shape Evolution During Electrodeposition

Xiaohai Li,Timothy O. Drews,Effendi Rusli,Xue Feng,Yuan He,Richard D. Braatz,Richard C. Alkire

DOI: https://doi.org/10.1149/1.2434686

IF: 3.9

2007-01-01

Journal of The Electrochemical Society

Abstract:A multiscale simulation model was developed to simulate shape evolution during copper electrodeposition in the presence of additives. The model dynamically coupled a kinetic Monte Carlo (KMC) model (for surface chemistry and roughness evolution) with a finite volume (FV) model (for transport and chemical reactions in the electrolyte) and a level-set code (for tracking macroscopic movement of the metal/electrolyte interface). The KMC code was coarse-grained and used a multisite mesoparticle approach to account for the adsorption of large molecules. A multilevel grid approach was used to achieve numerical efficiency and accurate interface tracking. The model was demonstrated for an application involving in-fill of two-dimensional trenches by copper electrodeposition with additives [bis(3-sulfopropyl)disulfide], polyethylene glycol, chloride, and l-(2-hydroxyethyl)-2-imidazolidinethione. Demonstration calculations were carried out with use of initial estimates for the physicochemical parameters associated with a proposed reaction mechanism. The approach was found to be feasible for computing stable, dynamic behavior during macroscopic shape evolution over extended periods of time while simultaneously tracking microscopic roughness evolution associated with nearly molecular scale events at the surface. Numerical results include predictions of the surface concentration distributions as a function of time and distance for each reactant, product, and intermediate species associated with the proposed reaction mechanism.

Additive Behavior in Cu Electroplating and the Recrystallization of Plated Cu

Simulation of TSV Copper Electrodeposition Process with Additives

Electrochemical Analysis of Cathode in TSV Copper Electroplating

A novel bright additive for copper electroplating: electrochemical and theoretical study

Initial surface roughness of electrochemical plating copper under different conditions

TSV Cu Plating and Implications for CMP

Study on Cu-Sn Alloy Electrodeposition

Corrosion Behaviour of Cu-Sn-Zn Ternary Alloy Electrodeposited via Less Hazardous Electrolyte

Effects of Fe(III) and Cu(I) on Electrodeposition and Microstructure Characterization for Acid Plating Bath

Copper Electroplating with Polyethylene Glycol: Part II. Experimental Analysis and Determination of Model Parameters

Electroless Plating of Copper on Al2o3 and Its Heat Treatment Behaviour

Study on the Behavior of Zn–Fe Alloy Electroplating

Electrochemical behaviors of additives in high Cu(II) concentration solution for high-aspect-ratio through ceramic holes filling

Combined fluid flow simulation with electrochemical measurement for mechanism investigation of high-rate Cu pattern electroplating

Simulation of Shape Evolution during Electrodeposition of Copper in the Presence of Additive

Electrocrystallization of Cu, Sn, and Сu-Sn alloys from sulfate electrolytes in the presence of thiourea and N -octylpyridinium bromide: Experimental and computational studies

In Situ Study of Copper Electrodeposition on A Single Carbon Fiber

Observation of the Behavior of Additives in Copper Electroplating Using a Microfluidic Device

Investigation of benzoquinone as a new type of Cu electroplating additive

Effect of Additives on Shape Evolution During Electrodeposition