Removal of nickel from chemical plating waste solution through precipitation and production of microsized nickel hydroxide particles

Tzu-Hsuan Tsai,Hao-Wei Chou,Yung-Fu Wu

DOI: https://doi.org/10.1016/j.seppur.2020.117315

IF: 8.6

2020-11-01

Separation and Purification Technology

Abstract:Chemical plating of nickel is widely used in wafer packaging. However, frequent renewal of plating baths generates a large amount of waste solution. When hazardous Ni2+ ions are removed from waste solutions through chemical precipitation, the complexing agent in the solution hinders nickel removal and reduces the nickel hydroxide [Ni(OH)2] precipitate size to approximately 0.5 μm. This study revealed that the precipitation rate of Ni(OH)2 can be controlled by the pH, temperature, and agitation. Furthermore, a Ni removal efficiency of more than 98% can be achieved. X-ray diffraction analysis revealed that the recovered particles included amorphous Ni(OH)2 and α-Ni(OH)2, indicating a high potential for energy conversion in nickel-based secondary batteries. Therefore, the proposed method can be used to sustain a circular economy by creating a Ni waste-to-energy cycle.

engineering, chemical