Inflight fiber printing toward array and 3D optoelectronic and sensing architectures

Wenyu Wang,Karim Ouaras,Alexandra L. Rutz,Xia Li,Magda Gerigk,Tobias E. Naegele,George G. Malliaras,Yan Yan Shery Huang

DOI: https://doi.org/10.1126/sciadv.aba0931

IF: 13.6

2020-10-02

Science Advances

Abstract:From capturing your breath to “floating” 3D electronics, inflight printing of tiny, invisible conducting fibers does the magic.

multidisciplinary sciences

What problem does this paper attempt to address?

(Invited) Mechanically Flexible Integrated Photonic Systems for Sensing and Communications

Lan Li,Hongtao Lin,Jerome Michon,Sarah Geiger,Junying Li,Hanyu Zheng,Yizhong Huang,Anupama Yadav,Kathleen Richardson,Tian Gu,Juejun Hu

DOI: https://doi.org/10.1149/07707.0037ecst

2017-01-01

Abstract:Conventional integrated photonic devices are fabricated on rigid semiconductor or dielectric substrates and are therefore inherently incompatible with soft biological tissues. Over the past few years, we have developed a suite of active and passive photonic devices and systems integrated on plastic substrates which can be bent, twisted, and stretched without compromising their optical performance. Here we review the latest progress in this emerging field, and discuss the rational material and mechanical engineering principles underlying the extraordinary flexibility of these photonic structures. Leveraging these design strategies, we demonstrated bendable glass waveguide circuits, flexible waveguide-integrated nanomembrane photodetectors, and stretchable photonics.
Future Thread: Printing Electronics on Fibers

Manoj Jose,Emily Bezerra Alexandre,Lukas Neumaier,Lukas Rauter,Mani Teja Vijjapu,Wolfgang Muehleisen,Muhammad Hassan Malik,Johanna Zikulnig,Jürgen Kosel

DOI: https://doi.org/10.1021/acsami.3c15422

IF: 9.5

2024-02-05

ACS Applied Materials & Interfaces

Abstract:This article introduces a methodology to increase the integration density of functional electronic features on fibers/threads/wires through additive deposition of functional materials via printed electronics. It opens the possibility to create a multifunctional intelligent system on a single fiber/thread/wire while combining the advantages of existing approaches, i.e., the scalability of coating techniques and the microfeatures of semiconductor-based fabrication. By directly printing on threads...

materials science, multidisciplinary,nanoscience & nanotechnology
Numerical Model of Jet Formation During Melt Electrowriting for Fabrication of Precise Structures

Xiaodan Huo,Huinan Lai,Qian Wu,Qingru Huang,Ying Han,Kaiwen Li,Jun Yin,Xiaona Lin

DOI: https://doi.org/10.1016/j.addma.2024.104569

IF: 11

2024-01-01

Additive Manufacturing

Abstract:Melt electrowriting (MEW) is an innovative technique for fabricating 3D porous materials or scaffolds with microscale architectures. However, the multitude of printing parameters makes precise control over the placement of microscale polymer fibers challenging. This study presents a new strategy for creating complex 3D structures using multiparametric MEW technology, which enhances printing accuracy with minimal human intervention. We developed and validated a numerical model to simulate jet formation and predict the critical translational speed (CTS). This model can precisely identify the effects of numerous printing parameters and improve printing efficiency and accuracy while reducing costs, thus facilitating precise MEW deposition. Using this approach, we manufactured soft, stretchable constructs with a high surface area optimized through fine-tuned printing parameters. This straightforward and efficient technology enables the design of high-sensitivity strain sensors for monitoring human motion and stretchable devices for circuit protection. Furthermore, we examined the effect of printing accuracy and fiber orientation on cellular organization. Immunochemical staining demonstrated that aligned and high-precision scaffolds promote oriented growth. Additionally, the curved MEW structures open new avenues for exploring the combined effects of topographical cues and mechanical stimulation on nerve cell behaviors. This printing strategy provides valuable insights for future research on complex patterns using MEW for flexible electronics and tissue engineering.
Fabricating 1D Stretchable Fiber-shaped Electronics Based on Inkjet Printing Technology for Wearable Applications

Chi Zhang,Lei Zhang,Zhihua Pu,Bo Bao,Wenyu Ouyang,Dachao Li

DOI: https://doi.org/10.1016/j.nanoen.2023.108574

IF: 17.6

2023-06-01

Nano Energy

Abstract:Advanced microfabrication on small and curved fiber surfaces remains a critical challenge and an urgent need to develop high-performance fiber-shaped electronics and advance the next generation of wearable electronics technology. In this study, we propose the preparation of 1D stretchable fiber-shaped electronics via inkjet printing technology for wearable applications. Utilizing self-built precision rotary inkjet printing equipment and a surface chemical modification process, we achieve high-precision and customizable microfabrication onto ultra-low diameter fiber surfaces (minimum printing line width of 133 μm and a printable fiber diameter as low as 500 μm with a large curvature of 4000 m -1 ). More importantly, this fabricating method is non-destructive and can prepare 1D stretchable conductors by printing conductive inks with stretchable structures and optimizing various synthetic fibers, which exhibit remarkable conductivity, mechanical stability, and strain-insensitive properties in practical applications. Furthermore, we demonstrate the performance of several 1D stretchable electronics applications, including a fiber-shaped electrothermal device, triboelectric strain sensor, and supercapacitor. Our work will greatly promote the development of 1D fiber-shaped electronics and smart textiles with wearability, high performance, functional diversification, and low cost.

materials science, multidisciplinary,chemistry, physical,physics, applied,nanoscience & nanotechnology
Towards Digital Manufacturing of Smart Multimaterial Fibers

Camila Faccini de Lima,Louis A van der Elst,Veda Narayana Koraganji,Mengxin Zheng,Merve Gokce Kurtoglu,Alexander Gumennik

DOI: https://doi.org/10.1186/s11671-019-3031-x

2019-06-18

Nanoscale Res Lett

Abstract:Fibers are ubiquitous and usually passive. Optoelectronics realized in a fiber could revolutionize multiple application areas, including biosynthetic and wearable electronics, environmental sensing, and energy harvesting. However, the realization of high-performance electronics in a fiber remains a demanding challenge due to the elusiveness of a material processing strategy that would allow the wrapping of devices made in crystalline semiconductors, such as silicon, into a fiber in an ordered, addressable, and scalable manner. Current fiber-sensor fabrication approaches either are non-scalable or limit the choice of semiconductors to the amorphous ones, such as chalcogenide glasses, inferior to silicon in their electronic performance, resulting in limited bandwidth and sensitivity of such sensors when compared to a standard silicon photodiode. Our group substantiates a universal in-fiber manufacturing of logic circuits and sensory systems analogous to very large-scale integration (VLSI), which enabled the emergence of the modern microprocessor. We develop a versatile hybrid-fabrication methodology that assembles in-fiber material architectures typical to integrated microelectronic devices and systems in silica, silicon, and high-temperature metals. This methodology, dubbed "VLSI for Fibers," or "VLSI-Fi," combines 3D printing of preforms, a thermal draw of fibers, and post-draw assembly of fiber-embedded integrated devices by means of material-selective spatially coherent capillary breakup of the fiber cores. We believe that this method will deliver a new class of durable, low cost, pervasive fiber devices, and sensors, enabling integration of fabrics met with human-made objects, such as furniture and apparel, into the Internet of Things (IoT). Furthermore, it will boost innovation in 3D printing, extending the digital manufacturing approach into the nanoelectronics realm.
Recent Progress in Electrohydrodynamic Jet Printing for Printed Electronics: From 0D to 3D Materials

Sheng Bi,Rongyi Wang,Xu Han,Yao Wang,Dongchen Tan,Baiou Shi,Chengming Jiang,Zhengran He,Kyeiwaa Asare-Yeboah

DOI: https://doi.org/10.3390/coatings13071150

IF: 3.236

2023-06-25

Coatings

Abstract:Advanced micro/nano-flexible sensors, displays, electronic skins, and other related devices provide considerable benefits compared to traditional technologies, aiding in the compactness of devices, enhancing energy efficiency, and improving system reliability. The creation of cost-effective, scalable, and high-resolution fabrication techniques for micro/nanostructures built from optoelectronic materials is crucial for downsizing to enhance overall efficiency and boost integration density. The electrohydrodynamic jet (EHD) printing technology is a novel additive manufacturing process that harnesses the power of electricity to create fluid motion, offering unparalleled benefits and a diverse spectrum of potential uses for microelectronic printing in terms of materials, precision, accuracy, and cost-effectiveness. This article summarizes various applications of EHD printing by categorizing them as zero-dimensional (0D), one-dimensional (1D), two-dimensional (2D), and three-dimensional (3D) printing materials. Zero-dimensional (quantum dot) materials are predominantly utilized in LED applications owing to their superb optoelectronic properties, high color fidelity, adjustable color output, and impressive fluorescence quantum yield. One- and two-dimensional materials are primarily employed in FET and sensor technologies due to their distinctive physical structure and exceptional optoelectronic properties. Three-dimensional materials encompass nanometals, nanopolymers, nanoglass, and nanoporous materials, with nanometals and nanopolymers finding widespread application in EHD printing technology. We hope our work will facilitate the development of small-feature-size, large-scale flexible electronic devices via EHD printing.

materials science, multidisciplinary,physics, applied, coatings & films
Ultrafast Laser 3D Nanolithography of Fiber-Integrated Silica Microdevices

Dezhi Zhu,Shangben Jiang,Changrui Liao,Lei Xu,Ying Wang,Dejun Liu,Weijia Bao,Famei Wang,Haoqiang Huang,Xiaoyu Weng,Liwei Liu,Junle Qu,Yiping Wang

DOI: https://doi.org/10.1021/acs.nanolett.4c02680

2024-08-07

Abstract:Fiber-integrated micro/nanostructures play a crucial role in modern industry, mainly owing to their compact size, high sensitivity, and resistance to electromagnetic interference. However, the three-dimensional manufacturing of fiber-tip functional structures beyond organic polymers remains challenging. It is essential to construct fiber-integrated inorganic silica with designed functional nanostructures for microsystem applications. Here, we develop a strategy for the 3D nanolithography of fiber-integrated silica from hybrid organic-inorganic materials by ultrafast laser-induced multiphoton absorption. Without silica nanoparticles and polymer additives, the acrylate-functionalized precursors can be locally cross-linked through a nonlinear effect. Followed by annealing at low temperature, the as-printed micro/nanostructures are transformed to high-quality silica with sub-100 nm resolution. Silica microcantilever probes and microtoroid resonators are directly integrated onto the optical fiber, showing strong thermal stability and quality factors. This work provides a promising strategy for fabricating desired fiber-tip silica micro/nanostructures, which is helpful for the development of integrated functional device applications.
Liquid Crystal-Mediated 3D Printing Process to Fabricate Nano-Ordered Layered Structures

Ali Rouhollah Jalili,Alexandra Satalov,Sahar Nazari,Bryan Harry Rahmat Suryanto,Jing Sun,Mohammad Bagher Ghasemian,Mohannad Mayyas,Ahmad E Kandjani,Ylias M Sabri,Edwin Mayes,Suresh K Bhargava,Jun Araki,Cécile Zakri,Philippe Poulin,Dorna Esrafilzadeh,Rose Amal

DOI: https://doi.org/10.1021/acsami.1c05025

2021-06-23

Abstract:The emergence of three-dimensional (3D) printing promises a disruption in the design and on-demand fabrication of smart structures in applications ranging from functional devices to human organs. However, the scale at which 3D printing excels is within macro- and microlevels and principally lacks the spatial ordering of building blocks at nanolevels, which is vital for most multifunctional devices. Herein, we employ liquid crystal (LC) inks to bridge the gap between the nano- and microscales in a single-step 3D printing. The LC ink is prepared from mixtures of LCs of nanocellulose whiskers and large sheets of graphene oxide, which offers a highly ordered laminar organization not inherently present in the source materials. LC-mediated 3D printing imparts the fine-tuning required for the design freedom of architecturally layered systems at the nanoscale with intricate patterns within the 3D-printed constructs. This approach empowered the development of a high-performance humidity sensor composed of self-assembled lamellar organization of NC whiskers. We observed that the NC whiskers that are flat and parallel to each other in the laminar organization allow facile mass transport through the structure, demonstrating a significant improvement in the sensor performance. This work exemplifies how LC ink, implemented in a 3D printing process, can unlock the potential of individual constituents to allow macroscopic printing architectures with nanoscopic arrangements.
A printed luminescent flier inspired by plant seeds for eco-friendly physical sensing

Kliton Cikalleshi,Albenc Nexha,Thomas Kister,Marilena Ronzan,Alessio Mondini,Stefano Mariani,Tobias Kraus,Barbara Mazzolai

DOI: https://doi.org/10.1126/sciadv.adi8492

2023-11-15

Abstract:Continuous and distributed monitoring of environmental parameters may pave the way for developing sustainable strategies to tackle climate challenges. State-of-the-art technologies, made with electronic systems, are often costly, heavy, and generate e-waste. Here, we propose a new generation of self-deployable, biocompatible, and luminescent artificial flying seeds for wireless, optical, and eco-friendly monitoring of environmental parameters (i.e., temperature). Inspired by natural Acer campestre plant seeds, we developed three-dimensional functional printed luminescent seed-like fliers, selecting polylactic acid as a biocompatible matrix and temperature as a physical parameter to be monitored. The artificial seeds mimic the aerodynamic and wind dispersal performance of the natural ones. The sensing properties are given by the integration of fluorescent lanthanide-doped particles, whose photoluminescence properties depend on temperature. The luminescent artificial flying seeds can be optically read from a distance using eye-safe near-infrared wavelengths, thus acting as a deployable sensor for distributed monitoring of topsoil environmental temperatures.
3D Printing High‐Resolution Conductive Elastomeric Structures with a Solid Particle‐Free Emulsion Ink

Chen Wang,Gaurav Chaudhary,Randy H. Ewoldt,Ralph G. Nuzzo

DOI: https://doi.org/10.1002/adem.202100902

IF: 3.6

2021-08-18

Advanced Engineering Materials

Abstract:Fabricating complex structures on micro and mesoscales is a critical aspect in the design of advanced sensors and soft electronics. While soft lithographic methods offer an important approach to fabricating such structures, the progress in the field of additive manufacturing (e.g. 3D printing) offers methods of fabrication with much more material complexity. The rheological complexity of the printing material, however, often dictates the limitations of printing. In particular, the challenges involved in synthesizing printing materials that can enable shape retention at smaller scales (<100 μm), yet be conductive, limits many applications of 3D printing to soft microelectronics. Here a printing-centered approach using a novel particle-free conductive emulsion ink is presented. Our approach separates the printing and polymerization of a conductive monomer (pyrrole) and renders a novel ink that is used to print filaments with heretofore impossible to realize 3D feature dimensions and build structures with high shape-retention. The printability of the ink is evaluated, and post-treatment properties assessed. Multidirectional strain sensors were printed using the emulsion ink to illustrate an exemplary application in soft electronics.This article is protected by copyright. All rights reserved.

materials science, multidisciplinary
Direct-Write, Self-Aligned Electrospinning on Paper for Controllable Fabrication of Three-Dimensional Structures.

Guoxi Luo,Kwok Siong Teh,Yumeng Liu,Xining Zang,Zhiyu Wen,Liwei Lin

DOI: https://doi.org/10.1021/acsami.5b08909

IF: 9.5

2015-01-01

ACS Applied Materials & Interfaces

Abstract:Electrospinning, a process that converts a solution or melt droplet into an ejected jet under a high electric field, is a well-established technique to produce one-dimensional (1D) fibers or two-dimensional (2D) randomly arranged fibrous meshes. Nevertheless, the direct electrospinning of fibers into controllable three-dimensional (3D) architectures is still a nascent technology. Here, we apply the near-field electrospinning (NFES) to direct write arbitrarily shaped 3D structures through consistent and spatially controlled fiber-by-fiber stacking of polyvinylidene fluoride (PVDF) fibers. An element central to the success of this 3D electrospinning is the use of a printing paper placed on the grounded conductive plate and acts as fibers collector. Once deposited on paper, residual solvents from near-field electrospun fibers can infiltrate the paper substrate, enhancing the charge transfer between the deposited fibers and ground plate via the fibrous network within the paper. Such charge transfer grounds the deposited fibers and turns them into locally fabricated electrical poles, which attract subsequent in-flight fibers to deposit in a self-aligned manner on top of each other. This process enables the design and controlled fabrication of electrospun 3D structures such as grids, walls, hollow cylinders, and other 3D logos. As such, this technique has the potential to advance the existing electrospinning technologies in constructing 3D structures for biomedical, microelectronics and MEMS/NMES applications.
3D‐printed Coaxial Fibers for Integrated Wearable Sensor Skin

Yang Gao,Guohui Yu,Tao Shu,Yonqiu Chen,Wenzhen Yang,Yu Liu,Jing Long,Wei Xiong,Fuzhen Xuan

DOI: https://doi.org/10.1002/admt.201900504

IF: 6.8

2019-01-01

Advanced Materials Technologies

Abstract:Coaxial 3D printing technology, with its advantages of scalability and controllability, is applied in research to develop integrated wearable sensors composed of pressure sensor arrays and strain sensors. In order to improve the performance of the pressure sensor array, microstructures molded from sandpaper are introduced into the contact interface of the extruded fibers, resulting in a sensitivity (defined as the ratio of capacitance change to the change of applied pressure) of 0.562 kPa−1, a response/relaxation time of 230 ms, and a high durability. The printed strain sensor has a sensitivity (defined as the ratio of resistance change to the change of applied strain) of 11.8 and a good stability for 10 000 cycles. The high‐performance pressure sensor array and strain sensors give the integrated device the ability to detect various mechanical stimuli such as pressing, bending, twisting, and shear forces, showing potential application in the field of electronic skin.
Thermally Drawn Advanced Functional Fibers: New Frontier of Flexible Electronics

Wei Yan,Chaoqun Dong,Yuanzhuo Xiang,Shan Jiang,Andreas Leber,Gabriel Loke,Wenxin Xu,Chong Hou,Shifeng Zhou,Min Chen,Run Hu,Perry Ping Shum,Lei Wei,Xiaoting Jia,Fabien Sorin,Xiaoming Tao,Guangming Tao

DOI: https://doi.org/10.1016/j.mattod.2019.11.006

IF: 24.2

2020-01-01

Materials Today

Abstract:Electronic devices are evolving from rigid devices into flexible and stretchable structures, enabling a seamless integration of electronics into our everyday lives. The integration of a variety of electronic materials within thermal-drawn fibers has emerged as a versatile platform for the fabrication of advanced functional fiber electronics. This approach exploits the thermal drawing of a macroscopic preform, where functional materials or prefabricated devices are arranged at a prescribed position, yielding kilometers of electronic fibers with a sophisticated architecture and complex functionalities in a very simple and scalable manner. A single strand of fiber that incorporates materials with disparate electronic, optoelectronics, thermomechanical, rheological and acoustic properties can see objects, hear sound, sense stimuli, communicate, store and convert energy, modulate temperature, monitor health and dissect brains. Integrating these electronic fibers into fabrics, ancient yet largely underdeveloped forms, is setting a stage for fabrics to be the next frontier in computation and Artificial Intelligence. Here, we critically review the development of thermally drawn fiber electronics and highlight their unique opportunities in communications, sensing, energy, artificial muscles, 3-D printing, healthcare, neuroscience as well as in-fiber materials fundamental research. We conclude some perspectives for realizing an analogue of “Moore’s law” in fibers and fabrics and the remaining challenges for future research.
Room-temperature high-precision printing of flexible wireless electronics based on MXene inks

Yuzhou Shao,Lusong Wei,Xinyue Wu,Chengmei Jiang,Yao Yao,Bo Peng,Han Chen,Jiangtao Huangfu,Yibin Ying,Chuanfang John Zhang,Jianfeng Ping

DOI: https://doi.org/10.1038/s41467-022-30648-2

IF: 16.6

2022-06-09

Nature Communications

Abstract:Abstract Wireless technologies-supported printed flexible electronics are crucial for the Internet of Things (IoTs), human-machine interaction, wearable and biomedical applications. However, the challenges to existing printing approaches remain, such as low printing precision, difficulty in conformal printing, complex ink formulations and processes. Here we present a room-temperature direct printing strategy for flexible wireless electronics, where distinct high-performance functional modules (e.g., antennas, micro-supercapacitors, and sensors) can be fabricated with high resolution and further integrated on various flat/curved substrates. The additive-free titanium carbide (Ti 3 C 2 T x ) MXene aqueous inks are regulated with large single-layer ratio (>90%) and narrow flake size distribution, offering metallic conductivity (~6, 900 S cm −1 ) in the ultrafine-printed tracks (3 μm line gap and 0.43% spatial uniformity) without annealing. In particular, we build an all-MXene-printed integrated system capable of wireless communication, energy harvesting, and smart sensing. This work opens a door for high-precision additive manufacturing of printed wireless electronics at room temperature.

multidisciplinary sciences
Microstructured fiber links for THz communications and their fabrication using infinity printing

Guofu Xu,Kathirvel Nallappan,Yang Cao,Maksim Skorobogatiy

DOI: https://doi.org/10.48550/arXiv.2106.04578

2021-06-08

Optics

Abstract:In this work, a novel infinity 3D printing technique is explored to fabricate continuous multi-meter-long low-loss near-zero dispersion suspended-core polypropylene fibers for application in terahertz (THz) communications. Particular attention is paid to process parameter optimization for 3D printing with low-loss polypropylene plastic. Three microstructured THz fibers were 3D printed using the standard and infinity 3D printers, and an in-depth theoretical and experimental comparison between the fibers were carried out. Transmission losses (by power) of 4.79 dB/m, 17.34 dB/m and 11.13 dB/m are experimentally demonstrated for the three fibers operating at 128 GHz. Signal transmission with BER far below the forward error correction limit (10-3) for the corresponding three fiber types of lengths of 2 m, 0.75 m and 1.6 m are observed, and an error-free transmission is realized at the bit rates up to 5.2 Gbps. THz imaging of the fiber near-field is used to visualize modal distributions and study optimal fiber excitation conditions. The ability of shielding the fundamental mode from the environment, mechanical robustness and ease of handling of thus developed effectively single-mode high optical performance fibers make them excellent candidates for upcoming fiber-assisted THz communications. Additionally, novel fused deposition modeling (FDM)-based infinity printing technique allows continuous fabrication of unlimited in length fibers of complex transverse geometries using advanced thermoplastic composites, which, in our opinion, is poised to become a key fabrication technique for advanced terahertz fiber manufacturing.
Three-Dimensional Electronic Microfliers With Designs Inspired by Wind-Dispersed Seeds

John Rogers,Bong Hoon Kim,Kan Li,Jin-Tae Kim,Yoonseok Park,Hokyung Jang,Xueju Wang,Zhaoqian Xie,Sang Won,Woo Jin Jang,Kun Hyuk Lee,Ted Chung,Yei Hwan Jung,Seung Yun Heo,Yechan Lee,Juyun Kim,Tengfei Cai,Yeonha Kim,Poom Prasopsukh,YongJoon Yu,Xinge Yu,Haiwen Luan,Honglie Song,Feng Zhu,Ying Zhao,Lin Chen,Seung Ho Han,Jiwoong Kim,Soong Ju Oh,Heon Lee,Chi Hwan Lee,Yonggang Huang,Leonardo Chamorro,Yihui Zhang

DOI: https://doi.org/10.21203/rs.3.rs-142068/v1

2021-01-01

Abstract:Abstract Large, distributed collections of miniaturized, wireless electronic devices may form the basis of future systems for environmental monitoring, population surveillance, disease management and other applications that demand coverage over expansive spatial scales. In this paper, we show that wind-dispersed seeds can serve as the bio-inspiration for unusual aerial schemes to distribute components for such networks via controlled, unpowered flight across natural environments or city settings. Techniques in mechanically guided assembly of three-dimensional (3D) mesostructures provide access to miniature, 3D fliers optimized for such purposes, in processes that align with the most sophisticated production techniques for electronic, optoelectronic, microfluidic and microelectromechanical technologies. We demonstrate a range of 3D macro-, meso- and microscale fliers produced in this manner, including those that incorporate active electronic payloads. Analytical, computational and experimental studies of the aerodynamics of high-performance structures of this type establish a set of fundamental considerations in bio-inspired design, with a focus on 3D fliers that exhibit controlled rotational kinematics and low terminal velocities. Battery-free, wireless devices for atmospheric measurements provide simple examples of a wide spectrum of applications of these unusual concepts.
Flexible and Stretchable Liquid‐Metal Microfluidic Electronics Using Directly Printed 3D Microchannel Networks

Kento Yamagishi,Terry Ching,Nicole Chian,Martin Tan,Wenshen Zhou,Shao Ying Huang,Michinao Hashimoto

DOI: https://doi.org/10.1002/adfm.202311219

IF: 19

2023-12-10

Advanced Functional Materials

Abstract:This study showcases a method to fabricate elastomeric 3D microchannel networks using direct ink writing 3D printing. The integration of electronic components within the microchannel, coupled with the injection of liquid metal into the coil‐shaped multilayered microchannel, enables the fabrication of flexible and stretchable liquid metal antenna coils. This paper describes a method for fabricating microfluidic electronics with 3D interconnected networks by direct ink writing (DIW)‐based 3D printing. Existing 3D printing technologies have yet to simultaneously realize 1) direct printing of interconnected multilayered microchannels without supporting materials or post‐processing and 2) integration of electronic elements with microchannels during the process of printing. This research aims to develop a method to fabricate support‐free microchannels consisting of silicone sealant without the collapse of the extruded structure while integrating electronic elements during the fabrication by DIW. The injection of liquid metal into 3D‐printed microchannels allows the formation of electrical connections between 3D conductive networks and the embedded electronic elements, enabling the fabrication of flexible and stretchable liquid metal antenna coils. To demonstrate a practical application, 1) a skin‐attachable radio‐frequency identification (RFID) tag using a commercial skin‐adhesive plaster as a substrate and 2) free‐standing flexible wireless light‐emitting devices with a small footprint (21.4 mm × 15 mm) for potential implantable applications are produced. This technology will offer a new capability to realize the automated fabrication of stretchable printed circuits with 3D configuration of electrical circuits consisting of liquid metals.

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology
3D Printing of Glass Micro-Optics with Subwavelength Features on Optical Fiber Tips

Lee-Lun Lai,Po-Han Huang,Göran Stemme,Frank Niklaus,Kristinn B. Gylfason,Göran Stemme

DOI: https://doi.org/10.1021/acsnano.3c11030

IF: 17.1

2024-03-30

ACS Nano

Abstract:Integration of functional materials and structures on the tips of optical fibers has enabled various applications in micro-optics, such as sensing, imaging, and optical trapping. Direct laser writing is a 3D printing technology that holds promise for fabricating advanced micro-optical structures on fiber tips. To date, material selection has been limited to organic polymer-based photoresists because existing methods for 3D direct laser writing of inorganic materials involve high-temperature...

materials science, multidisciplinary,chemistry, physical,nanoscience & nanotechnology
The Rise of Fiber Electronics

Xiaojie Xu,Songlin Xie,Ye Zhang,Huisheng Peng

DOI: https://doi.org/10.1002/anie.201902425

2019-01-01

Angewandte Chemie International Edition

Abstract:AbstractAs a new direction in applied chemistry, fiber electronics allow device configuration to evolve from three to two dimensions and then to one dimension. The reduction in dimension brings unique properties, such as ultraflexibility, tissue adaptability, and weavability, enabling their use in a variety of applications, particularly in various emerging fields related to implantable devices and wearable systems. The different types of fiber electrode materials are summarized based on the one‐dimensional configuration and their distinctive interfaces, various devices, and promising applications. The remaining challenges and future directions are finally highlighted.
High-Efficiency High-Resolution Multimaterial Fabrication For Digital Light Processing-Based Three-Dimensional Printing

Kavin Kowsari,Saeed Akbari,Dong Wang,Nicholas X. Fang,Qi Ge

DOI: https://doi.org/10.1089/3dp.2018.0004

IF: 5.355

2018-01-01

3D Printing and Additive Manufacturing

Abstract:We developed and constructed a novel digital light processing-based microstereolithography three-dimensional printing system capable of producing high-resolution components made of multiple materials in a fully automated, efficient, layer-by-layer manner. A high-contrast digital micro display with a pixel size of 15 mu m was used to project customized 405 nm images through a borosilicate glass plate coated with optically clear polytetrafluoroethylene to induce polymerization in a variety of acrylate-based photocurable polymeric resins, where each layer contained multiple resin types. The new minimal-waste material exchange mechanism involves an air jet to remove residual liquid resin attached to the substrate after each exposure, which eliminated the need to use cleaning solutions that have been known to damage printed features. Complex, multimaterial microlattice structures were printed about 58% faster than existing studies that used cleaning solutions. Mechanical tests of tensile specimens demonstrated that the printing process formed sufficiently strong bonds between differing materials. The multimaterial capabilities of the new system, demonstrated as proof-of-concept in this article using photocurable polymer varieties, open doors for potential high-resolution high-efficiency multimaterial fabrication of a broad range of microarchitectures with novel functionalities and optimized performance made of ceramic, metallic, and biomaterials that find applications in the fields of metamaterials, bioinspired soft robotics, biodevices, microelectromechanical systems, optics, and microfluidics. System optimization to facilitate such capabilities remains as motives for complementary studies.

Inflight fiber printing toward array and 3D optoelectronic and sensing architectures

(Invited) Mechanically Flexible Integrated Photonic Systems for Sensing and Communications

Future Thread: Printing Electronics on Fibers

Numerical Model of Jet Formation During Melt Electrowriting for Fabrication of Precise Structures

Fabricating 1D Stretchable Fiber-shaped Electronics Based on Inkjet Printing Technology for Wearable Applications

Towards Digital Manufacturing of Smart Multimaterial Fibers

Recent Progress in Electrohydrodynamic Jet Printing for Printed Electronics: From 0D to 3D Materials

Ultrafast Laser 3D Nanolithography of Fiber-Integrated Silica Microdevices

Liquid Crystal-Mediated 3D Printing Process to Fabricate Nano-Ordered Layered Structures

A printed luminescent flier inspired by plant seeds for eco-friendly physical sensing

3D Printing High‐Resolution Conductive Elastomeric Structures with a Solid Particle‐Free Emulsion Ink

Direct-Write, Self-Aligned Electrospinning on Paper for Controllable Fabrication of Three-Dimensional Structures.

3D‐printed Coaxial Fibers for Integrated Wearable Sensor Skin

Thermally Drawn Advanced Functional Fibers: New Frontier of Flexible Electronics

Room-temperature high-precision printing of flexible wireless electronics based on MXene inks

Microstructured fiber links for THz communications and their fabrication using infinity printing

Three-Dimensional Electronic Microfliers With Designs Inspired by Wind-Dispersed Seeds

Flexible and Stretchable Liquid‐Metal Microfluidic Electronics Using Directly Printed 3D Microchannel Networks

3D Printing of Glass Micro-Optics with Subwavelength Features on Optical Fiber Tips

The Rise of Fiber Electronics

High-Efficiency High-Resolution Multimaterial Fabrication For Digital Light Processing-Based Three-Dimensional Printing