High‐Resolution 3D Printing for Electronics (Adv. Sci. 8/2022)

Young‐Geun Park,Insik Yun,Won Gi Chung,Wonjung Park,Dong Ha Lee,Jang‐Ung Park

DOI: https://doi.org/10.1002/advs.202270046

IF: 15.1

2022-03-01

Advanced Science

Abstract:Advanced Science, Volume 9, Issue 8, March 15, 2022.

materials science, multidisciplinary,nanoscience & nanotechnology,chemistry

What problem does this paper attempt to address?

High‐Resolution 3D Printing for Electronics

Young‐Geun Park,Insik Yun,Won Gi Chung,Wonjung Park,Dong Ha Lee,Jang‐Ung Park

DOI: https://doi.org/10.1002/advs.202104623

IF: 15.1

2022-01-17

Advanced Science

Abstract:The ability to form arbitrary 3D structures provides the next level of complexity and a greater degree of freedom in the design of electronic devices. Since recent progress in electronics has expanded their applicability in various fields in which structural conformability and dynamic configuration are required, high-resolution 3D printing technologies can offer significant potential for freeform electronics. Here, the recent progress in novel 3D printing methods for freeform electronics is reviewed, with providing a comprehensive study on 3D-printable functional materials and processes for various device components. The latest advances in 3D-printed electronics are also reviewed to explain representative device components, including interconnects, batteries, antennas, and sensors. Furthermore, the key challenges and prospects for next-generation printed electronics are considered, and the future directions are explored based on research that has emerged recently.

materials science, multidisciplinary,nanoscience & nanotechnology,chemistry
3D-printing and advanced manufacturing for electronics

Alejandro H. Espera,John Ryan C. Dizon,Qiyi Chen,Rigoberto C. Advincula

DOI: https://doi.org/10.1007/s40964-019-00077-7

2019-02-04

Progress in Additive Manufacturing

Abstract:Printed electronics currently holds a significant share in the electronics fabrication market due to advantages in high-throughput production and customizability in terms of material support and system process. The printing of traces and interconnects, passive and active components such as resistors, capacitors, inductors, and application-specific electronic devices, have been a growing focus of research in the area of additive manufacturing. Adaptation of new 3D-printing technologies and manufacturing methods, specifically for printed electronics, are potentially transformative in flexible electronics, wireless communications, efficient batteries, solid-state display technologies, etc. Other than printing new and reactive functional electronic materials, the functionalization of the printing substrates with unusual geometries apart from the conventional planar circuit boards will be a challenge. Building the substrate, printing the conductive tracks, pick-and-placing or embedding the electronic components, and interconnecting them, are fundamental fabrication protocols new 3D-printing systems should adopt for a more integrated fabrication. Moreover, designers and manufacturers of such systems will play an important role in scaling 3D-printed electronics from prototyping to high-throughput mass production. This review gives a groundwork for such understanding, defining methods and protocols, reviewing various 3D-printing methods, and describing the state-of-the-art in 3D-printed electronics and their future growth.

English Else
High Precision 3D Printing for Micro to Nano Scale Biomedical and Electronic Devices

Kirsty Muldoon,Yanhua Song,Zeeshan Ahmad,Xing Chen,Ming-Wei Chang

DOI: https://doi.org/10.3390/mi13040642

IF: 3.4

2022-04-18

Micromachines

Abstract:Three dimensional printing (3DP), or additive manufacturing, is an exponentially growing process in the fabrication of various technologies with applications in sectors such as electronics, biomedical, pharmaceutical and tissue engineering. Micro and nano scale printing is encouraging the innovation of the aforementioned sectors, due to the ability to control design, material and chemical properties at a highly precise level, which is advantageous in creating a high surface area to volume ratio and altering the overall products’ mechanical and physical properties. In this review, micro/-nano printing technology, mainly related to lithography, inkjet and electrohydrodynamic (EHD) printing and their biomedical and electronic applications will be discussed. The current limitations to micro/-nano printing methods will be examined, covering the difficulty in achieving controlled structures at the miniscule micro and nano scale required for specific applications.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
The Emerging Frontiers and Applications of High-Resolution 3D Printing

Mao Mao,Jiankang He,Xiao Li,Bing Zhang,Qi Lei,Yaxiong Liu,Dichen Li

DOI: https://doi.org/10.3390/mi8040113

IF: 3.4

2017-04-01

Micromachines

Abstract:Over the past few decades, there has been an increasing interest in the fabrication of complex high-resolution three-dimensional (3D) architectures at micro/nanoscale. These architectures can be obtained through conventional microfabrication methods including photolithography, electron-beam lithography, femtosecond laser lithography, nanoimprint lithography, etc. However, the applications of these fabrication methods are limited by their high costs, the generation of various chemical wastes, and their insufficient ability to create high-aspect-ratio 3D structures. High-resolution 3D printing has recently emerged as a promising solution, as it is capable of building multifunctional 3D constructs with optimal properties. Here we present a review on the principles and the recent advances of high-resolution 3D printing techniques, including two-photon polymerization (TPP), projection microstereoLithography (PµSL), direct ink writing (DIW) and electrohydrodynamic printing (EHDP). We also highlight their typical applications in various fields such as metamaterials, energy storage, flexible electronics, microscale tissue engineering scaffolds and organ-on-chips. Finally, we discuss the challenge and perspective of these high-resolution 3D printing techniques in technical and application aspects. We believe that high-resolution 3D printing will eventually revolutionize the microfabrication processes of 3D architectures with high product quality and diversified materials. It will also find applications in a wide scope.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
3D printed electronics: Processes, materials and future trends

Hong Wei Tan,Yu Ying Clarrisa Choong,Che Nan Kuo,Hong Yee Low,Chee Kai Chua

DOI: https://doi.org/10.1016/j.pmatsci.2022.100945

IF: 48.165

2022-06-01

Progress in Materials Science

Abstract:In recent years, the industries and researchers have demonstrated a strong interest in 3D (3-dimensional) printed electronics due to their tremendous potentials to deliver unique features not attainable by traditional manufacturing methods. This latest technology is potentially revolutionary, and the upcoming research trend is inclining towards 3D embedded electrical devices, 3D conformal electronics, flexible 3D printed electronics and stretchable 3D printed electronics applications. A deep understanding of the advanced functional materials for the fabrication of 3D printing electronic devices is also important since there are so many different types of inks that exist. This review offers an in-depth overview for the latest 3D electronic printing techniques and developments in innovative practical technologies used to fabricate 3D printed electronics devices. The latest progress in the advanced functional materials used for fabricating 3D printed electronics devices and the upcoming application trends is thoroughly discussed too.

materials science, multidisciplinary
3D-printing and electronic packaging - current status and future challenges

C. Bailey,S. Stoyanov,T. Tilford,G. Tourloukis

DOI: https://doi.org/10.1109/eptc.2016.7887895

2016-11-01

Abstract:3D-Printing, or Additive Manufacturing, has received significant media attention during the last five years. A number of companies are now commercialising materials, design tools, and 3D-Printers and these are being used in a number of sectors for digital manufacturing including aerospace, medical, construction and consumer products. But what impact is 3D-Printing having on electronic packaging and manufacturing? Companies that produce and sell 3D-Printers as well as EDA and MCAD companies are now promoting 3D-Printing towards the electronics sector. This paper details the current status of 3D-printing for the manufacture and packaging of electronic systems, and provides some insights on how it may impact our community in the future. Challenges related to the performance and electrical behaviour of printed conductive materials are discussed as they must meet or better the performance of materials currently used. And of course the overall quality and reliability of any 3D-printed electronic system must meet industry requirements. The paper will detail developments taking place in design and modelling tools and how these can be used in addressing some of these challenges.
High-resolution, reconfigurable printing of liquid metals with three-dimensional structures

Young-Geun Park,Hyeon Seok An,Ju-Young Kim,Jang-Ung Park

DOI: https://doi.org/10.1126/sciadv.aaw2844

2019-06-21

Abstract:We report an unconventional approach for high-resolution, reconfigurable 3D printing using liquid metals for stretchable, 3D integrations. A minimum line width of 1.9 μm can be reliably formed using direct printing, and printed patterns can be reconfigured into diverse 3D structures with maintaining pristine resolutions. This reconfiguration can be performed multiple times, and it also generates a thin oxide interface that can be effective in preventing the spontaneous penetration of gallium atoms into different metal layers while preserving electrical properties under ambient conditions. Moreover, these free-standing features can be encapsulated with stretchable, conformal passivations. We demonstrate applications in the form of a reconfigurable antenna, which is tunable by changing geometeries, and reversibly movable interconnections used as mechanical switches. The free-standing 3D structure of electrodes is also advantageous for minimizing the number and space between interconnections, which is important for achieving higher integrations, as demonstrated in an array of microLEDs.
High-resolution hybrid printing of polymer and molten metal ink for printed electronics

Nusrat Yasmin,Jiang Shan,Yiwei Han

DOI: https://doi.org/10.1016/j.mfglet.2023.08.038

2023-08-01

Manufacturing Letters

Abstract:Highly integrated, on-demand printed electronics attract lots of attention. The current fabrication methods for printed electronics are restricted to one material class and one technology, which limits the geometry design and the resolution of final products. The hybrid printing process is a potential method to effectively fabricate microscale 3D electronics with high resolution. In this paper, we developed a high-resolution (∼100 µm) hybrid printing process that integrates Electrohydrodynamic (EHD) printing and extrusion-based printing with metallic and polymeric material, respectively. Here, we characterized and verified the effect of several critical parameters, such as printing speed, pressure, voltage, and overlap on the printing process and quality of the printed features. The optimal set of printing parameters was determined for the hybrid printing process to obtain high-efficient and high-resolution printing. The best result obtained for PLA 1st layer is speed 1 mm/s, pressure 0.8 kg/cm2, overlap 25%. For the PLA 2nd layer, the best printing results are speed 0.4 mm/s, pressure 1 kg/cm2, and overlap 11%. The optimum result obtained for metal EHD printing is voltage 1.5 KV and speed 0.3 mm/s. At the end, we successfully implemented the hybrid printing process and printed high-resolution 3D electronics to demonstrate the potential capabilities of such hybrid printing in the fabrication of customized microelectronics.
3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect

Chiyen Kim,David Espalin,Min Liang,Hao Xin,Alejandro Cuaron,Issac Varela,Eric Macdonald,Ryan B. Wicker

DOI: https://doi.org/10.1109/access.2017.2773571

IF: 3.9

2017-01-01

IEEE Access

Abstract:2-D printed electronics have been the focus of intense research for the past two decades primarily focused on implementing electrical interconnect by dispensing conductive binder-based inks. More recently, traditional printed electronics processes have been leveraged within 3-D printed structures where components and interconnect are introduced during fabrication interruptions. The dielectric performance of 3-D printed materials compares well with traditional printed circuit board (PCB) dielectrics but one remaining challenge is the low conductivity of printed ink traces. The performance degradation is due to curing temperature limits imposed by the properties of the polymer substrates. Thermoplastics, such as ULTEM, can maintain form at over 200 °C, but production ink curing processes require 850 °C to provide an appropriate conductivity. Previous reports have described submerging wires with selective energy within a thermoplastic substrate upon which 3-D printing can continue uninhibited. As copper wires have the same conductivity as PCBs and can be implemented in a wide range of cross-sectional areas, 3-D printed electronics are now in a position to transform the electronics industry. This paper describes an inter-layer process to insert metal connection between layers—allowing for improved routing density and leveraging the geometries brought to bear by 3-D printing. Minimum placement distance between these 3-D printed vias was initially 1.5 mm, and the vias can connect layers separated by as much as 2.8 mm in the vertical build direction (z-axis). As the number of wires layers that can be fabricated is not as limited as traditional board lamination, complex routing can be realized within mass customized, arbitrary shapes.

computer science, information systems,telecommunications,engineering, electrical & electronic
Air‐Pressure‐Assisted Pen‐Nib Printing for 3D Printed Electronics

Jinhyuck Ahn,Ho Hyung Sim,Je Hyeong Kim,Muhammad Wajahat,Jung Hyun Kim,Jongcheon Bae,Seonghyeon Kim,Jaeyeon Pyo,Chang Jun Jeon,Bum Seok Kim,Sung Hyun Baek,Seung Kwon Seol

DOI: https://doi.org/10.1002/admt.202101172

IF: 6.8

2021-11-05

Advanced Materials Technologies

Abstract:3D printed electronics employing direct‐ink‐writing methods are promising alternative manufacturing technologies for realizing structural electronics. The emerging demand for accessible, cost‐effective, and rapid writing calls for novel approaches to print functional components onto nonflat and 3D architectures. This study presents a novel air‐pressure‐assisted pen‐nib printing approach producing electrical and functional components with various material inks on flat and 3D surfaces. Based on the inks’ rheological properties, the ejected ink's quantity through the nib is manipulated via air pressure; thus, the printed line width is controlled. This strategy also achieves the viscosity range extension of printable inks by enabling printing inks that cannot be used in general pen‐based printing. Three functional inks with different rheological properties—Ag catalyst ink for Cu electroless deposition, Ag‐PEDOT:PSS ink, and thermochromic pigment inks are designed. Several electrical and functional components, such as highly conductive Cu interconnects, Cu spiral coils for wireless power transfer receivers, flexible heaters, and matrix data codes based on temperature‐responsive color transitions are demonstrated. Furthermore, parallel printing with a multi‐nib print‐head is demonstrated for improving the printing speed and manufacturing scalability. The authors believe that this novel approach is promising as a manufacturing technique for realizing 3D printed electronics. Air‐pressure‐assisted pen‐nib printing that can control ink ejection by negative (Pn) and positive (Pp) air pressure is developed. Several functional patterns and electrical components are printed using three inks with different rheological properties, such as Ag catalyst ink for Cu electroless deposition, Ag‐decorated PEDOT:PSS ink, and thermochromic pigment inks. Parallel printing with multi‐nib print‐head is also demonstrated.

materials science, multidisciplinary
Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex and High-Performance 3D Circuits

Xiaolong Li,Cheng Yao,Yujie Zhou,Shuyue Feng,Zhengke Li,Yiming Cheng,Shichao Huang,Haoye Dong,Mengru Xue,Guanyun Wang

DOI: https://doi.org/10.1145/3613905.3651098

2024-01-01

Abstract:In Human-Computer Interaction, multi-material 3D printing is increasingly recognized for its capacity to produce conductive interactive objects. While various fabrication techniques have emerged in this domain, achieving the integration of highly conductive 3D structures within printed objects continues to pose a significant technical hurdle. Our study introduces Intercircuit, a novel integrated technique developed explicitly for fabricating highly conductive interactive objects. This method employs multi-material printing to form unified components along with their embedded structures of lower conductivity, enhancing conductivity through targeted plating. Distinct from traditional multi-material printing and surface conductivity augmentation methods, the Intercircuit method facilitates the creation of complex 3D circuitry while ensuring superior conductivity. Furthermore, this study introduces a supportive design tool aimed at aiding users in crafting conductive frameworks. Moreover, the practical application of this method is further elucidated through a series of case studies.
Recent Progress in Electrohydrodynamic Jet Printing for Printed Electronics: From 0D to 3D Materials

Sheng Bi,Rongyi Wang,Xu Han,Yao Wang,Dongchen Tan,Baiou Shi,Chengming Jiang,Zhengran He,Kyeiwaa Asare-Yeboah

DOI: https://doi.org/10.3390/coatings13071150

IF: 3.236

2023-06-25

Coatings

Abstract:Advanced micro/nano-flexible sensors, displays, electronic skins, and other related devices provide considerable benefits compared to traditional technologies, aiding in the compactness of devices, enhancing energy efficiency, and improving system reliability. The creation of cost-effective, scalable, and high-resolution fabrication techniques for micro/nanostructures built from optoelectronic materials is crucial for downsizing to enhance overall efficiency and boost integration density. The electrohydrodynamic jet (EHD) printing technology is a novel additive manufacturing process that harnesses the power of electricity to create fluid motion, offering unparalleled benefits and a diverse spectrum of potential uses for microelectronic printing in terms of materials, precision, accuracy, and cost-effectiveness. This article summarizes various applications of EHD printing by categorizing them as zero-dimensional (0D), one-dimensional (1D), two-dimensional (2D), and three-dimensional (3D) printing materials. Zero-dimensional (quantum dot) materials are predominantly utilized in LED applications owing to their superb optoelectronic properties, high color fidelity, adjustable color output, and impressive fluorescence quantum yield. One- and two-dimensional materials are primarily employed in FET and sensor technologies due to their distinctive physical structure and exceptional optoelectronic properties. Three-dimensional materials encompass nanometals, nanopolymers, nanoglass, and nanoporous materials, with nanometals and nanopolymers finding widespread application in EHD printing technology. We hope our work will facilitate the development of small-feature-size, large-scale flexible electronic devices via EHD printing.

materials science, multidisciplinary,physics, applied, coatings & films
On the Resolution Limit of Electrohydrodynamic Redox 3D Printing

Maxence Menétrey,Cédric Kupferschmid,Stephan Gerstl,Ralph Spolenak

DOI: https://doi.org/10.1002/smll.202402067

IF: 13.3

2024-08-02

Small

Abstract:Additive manufacturing (AM) will empower the next breakthroughs in nanotechnology by combining unmatched geometrical freedom with nanometric resolution. Despite recent advances, no micro-AM technique has been able to synthesize functional nanostructures with excellent metal quality and sub-100 nm resolution. Here, significant breakthroughs in electrohydrodynamic redox 3D printing (EHD-RP) are reported by directly fabricating high-purity Cu (>98 at.%) with adjustable voxel size from >6µm down to 50 nm. This unique tunability of the feature size is achieved by managing in-flight solvent evaporation of the ion-loaded droplet to either trigger or prevent the Coulomb explosion. In the first case, the landing of confined droplets on the substrate allows the fabrication of high-aspect-ratio 50 nm-wide nanopillars, while in the second, droplet disintegration leads to large-area spray deposition. It is discussed that the reported pillar width corresponds to the ultimate resolution achievable by EHD printing. The unrivaled feature size and growth rate (>100 voxel s-1) enable the direct manufacturing of 30 µm-tall atom probe tomography (APT) tips that unveil the pristine microstructure and chemistry of the deposit. This method opens up prospects for the development of novel materials for 3D nano-printing.
Selectively Metalizable Stereolithography Resin for Three-Dimensional DC and High-Frequency Electronics via Hybrid Additive Manufacturing

Ji Li,Yan Zhang,Peiren Wang,Guoqi Wang,Yifei Liu,Yaning Liu,Qianshuai Li

DOI: https://doi.org/10.1021/acsami.1c01199

2021-05-07

Abstract:Direct manufacturing of customized end-use electronic products is becoming an emerging trend of additive manufacturing (AM). This highly demands the evolution of the conventional AM processes from simply building single-material parts to simultaneously delivering complex structures and end-use functionalities. In this work, we propose a novel hybrid additive manufacturing solution that combines stereolithography (SLA) three-dimensional (3D) printing and laser-activated electroless plating for the manufacture of 3D fully functional electronic products. With our newly developed functional SLA resin that can be 3D printed, laser-activated, and thereafter selectively metalized, high-resolution circuitry can be free-formly patterned on 3D structures. In virtue of high-performance electrical materials, this technology is capable of creating not only 3D direct-current (DC) electronics but also 3D high-frequency devices like microwave/millimeter-wave antennas, which cannot be fabricated via traditional printed circuit board (PCB) technology and not even by most AM processes. This study represents a significant advance in additive manufacturing technologies, and more importantly offers a unique opportunity for the mass customization of fully functional 3D electronic products, which shows great potentials in consumer electronics, communication engineering, and automobile and aerospace industries.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.1c01199?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.1c01199</a>.Double-side 3D LED blinking circuit (Movie S1) (<a class="ext-link" href="/doi/suppl/10.1021/acsami.1c01199/suppl_file/am1c01199_si_001.mp4">MP4</a>)Customized keychain with a non-contact electroprobe (Movie S2) (<a class="ext-link" href="/doi/suppl/10.1021/acsami.1c01199/suppl_file/am1c01199_si_002.mp4">MP4</a>)Settling of catalyst particles in the resin matrix; the explanation for spherical morphology of the copper-plated surface; circuit diagrams of DC applications; the geometry values of microwave antennas in this work; and sample preparation and permittivity measurements of resins (<a class="ext-link" href="/doi/suppl/10.1021/acsami.1c01199/suppl_file/am1c01199_si_003.pdf">PDF</a>)This article has not yet been cited by other publications.

materials science, multidisciplinary,nanoscience & nanotechnology
High‐Resolution Printing‐Based Vertical Interconnects for Flexible Hybrid Electronics

Sihang Ma,Abhishek Singh Dahiya,Adamos Christou,Ayoub Zumeit,Ravinder Dahiya

DOI: https://doi.org/10.1002/admt.202400130

IF: 6.8

2024-06-05

Advanced Materials Technologies

Abstract:Comprehensive studies comparing speed and throughput of the high‐resolution electrohydrodynamic and extrusion printers and the use of printing technologies for development of high‐density 3D integrated flexible hybrid electronic systems. Flexible hybrid electronics (FHE) is an emerging area that combines printed electronics and ultra‐thin chip (UTC) technology to deliver high performance needed in applications such as wearables, robotics, and internet‐of‐things etc. The integration of UTCs on flexible substrates and the access to devices on them requires high resolution interconnects, which is a challenging task as thermal and mechanical mismatches do not allow conventional bonding methods to work. To address this challenge, the resource‐efficient, area‐efficient, and low‐cost printing routes for obtaining vertical interconnection accesses (VIAs) are demonstrated here. It is demonstrated how high‐resolution printers (electrohydrodynamic and extrusion‐based direct‐ink writing printers) can be used for patterning of high‐resolution, freeform, vertical conductive structures. To access the transistors on UTCs, the VIAs, obtained using conventional photolithography and plasma etching steps, are filled with conductive silver nanoparticle‐based ink/paste using high‐resolution printers. Comprehensive studies are performed to compare and benchmark in terms of: i) the printing speed and throughput of the printers, ii) the electrical performance of vertically connected transistors in UTCs, and iii) the electrical performance stability of FHE system (interconnects and UTCs) under mechanical bending conditions. This in‐depth study shows the potential use of printing technologies for development of high‐density 3D integrated FHE systems.

materials science, multidisciplinary
Application of 3D and 4D Printing in Electronics

Matilde Aronne,Miriam Polano,Valentina Bertana,Sergio Ferrero,Francesca Frascella,Luciano Scaltrito,Simone Luigi Marasso

DOI: https://doi.org/10.3390/jmmp8040164

2024-07-31

Journal of Manufacturing and Materials Processing

Abstract:Nowadays, additive manufacturing technologies have impacted different engineering sectors. Three- and four-dimensional printing techniques are increasingly used in soft and flexible electronics thanks to the possibility of working contemporarily with several materials on various substrates. The materials portfolio is wide, as well as printing processes. Shape memory polymers, together with composites, have gained great success in the electronic field and are becoming increasingly popular for fabricating pH, temperature, humidity, and stress sensors that are integrated into wearable, stretchable, and flexible devices, as well as for the fabrication of communication devices, such as antennas. Here, we report an overview of the state of the art about the application of 4D printing technologies and smart materials in electronics.
Near thermal-electric field controlled electrohydrodynamic 3D printing of high aspect ratio microstructures

Dongya Li,Haodong Hong,Xinhu Sun,Yang Zhang,Yu Liu

DOI: https://doi.org/10.1088/1361-6439/acac3f

2022-12-17

Journal of Micromechanics and Microengineering

Abstract:Electrohydrodynamic (EHD) printing is an effective method for high-resolution two-dimensional patterning because of its high material compatibility. The latest research on three-dimensional (3D) structure fabrication has been reported for metal nanoparticles, small molecular materials, and phase change materials by process regulation. One of the main challenges in conventional EHD 3D printing of polymers is the low accuracy of filament deposition and stacking at the microscale. It is difficult to achieve a high aspect ratio for printed structures. This study develops an external field-assisted EHD printing process for polymer materials, where the filament formation can be improved by the near thermal field and the stacking accuracy of filaments is further promoted by applying an alternating voltage between layers. The feasibility of this method is demonstrated by printing polystyrene, a typical polymer material, on the silicon substrate with . The regulatory effect of the process parameters on the filament width is explored. The influence of the external thermal field on filament formation and deposition is discussed, and a promotion mechanism is revealed of alternating voltage for accurate deposition. Based on these combinative effects, micro-scale 3D structures with a high aspect ratio are successfully printed on the insulating substrate with three kinds of polymers.

engineering, electrical & electronic,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Advanced Materials in 3D/4D Printing Technology

Houwen Matthew Pan

DOI: https://doi.org/10.3390/polym14163255

IF: 5

2022-08-11

Polymers

Abstract:Advances made in 3D printing have opened new avenues for innovation in dental, aerospace, soft robotics, thermal regulation, and flexible electronic devices [...]

polymer science
High Resolution Dual Material Stereolithography for Monolithic Microdevices

Christina Schmidleithner,Rujing Zhang,Nayere Taebnia,Esben K. U. Larsen,Kristoffer Almdal,Niels B. Larsen

DOI: https://doi.org/10.1002/admt.202101180

IF: 6.8

2021-11-14

Advanced Materials Technologies

Abstract:Functional 3D components such as perfusion channels and mechanical actuation elements at cellular length scales can support cell survival and tissue maturation in tissue modeling devices. These advanced requirements call for increasingly complex materials and 3D fabrication methods. Here, a high‐resolution dual‐material 3D printing concept is developed, where distinct materials are produced locally by orthogonal chemical reactions depending on the illumination wavelength. A tough, stiff epoxy network results from cationic polymerization in UV light, while a soft and diffusion‐open hydrogel forms by free‐radical polymerization initiated by blue light. Thus, dual‐exposure allows for selection of material properties in every voxel, while retaining the 3D design flexibility associated with stereolithography. This enables single‐process fabrication of devices integrating mechanically stable chip‐to‐world interconnects and compliant, diffusion‐open perfusable channel components of 150 µm in width and height, while also allowing structural and mechanical feature dimensions down to 60 µm. A perfusion chip capable of creating a stable uniaxial chemical gradient by passive dye diffusion through hydrogel sections, and a negative Poisson ratio structure based on the interplay between stiff rotators and compliant hinges, are manufactured as proof‐of‐concept microdevices. Lastly, week‐long culture of hydrogel‐encapsulated human liver cells demonstrates the cytocompatibility of both materials. A dual material stereolithographic 3D printing method based on orthogonal radical or cationic photopolymerization is presented. Two distinct materials can be locally polymerized in parallel, controlled by the illumination wavelength. The method is demonstrated by combining a diffusion‐open poly(ethylene glycol) diacrylate (PEGDA) hydrogel and a tough, diffusion‐closed interpenetrating PEGDA/epoxy material at high resolutions to create complex monolithic devices.

materials science, multidisciplinary

High‐Resolution 3D Printing for Electronics (Adv. Sci. 8/2022)

High‐Resolution 3D Printing for Electronics

3D-printing and advanced manufacturing for electronics

High Precision 3D Printing for Micro to Nano Scale Biomedical and Electronic Devices

The Emerging Frontiers and Applications of High-Resolution 3D Printing

3D printed electronics: Processes, materials and future trends

3D-printing and electronic packaging - current status and future challenges

High-resolution, reconfigurable printing of liquid metals with three-dimensional structures

High-resolution hybrid printing of polymer and molten metal ink for printed electronics

3D Printed Electronics With High Performance, Multi-Layered Electrical Interconnect

Air‐Pressure‐Assisted Pen‐Nib Printing for 3D Printed Electronics

Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex and High-Performance 3D Circuits

Recent Progress in Electrohydrodynamic Jet Printing for Printed Electronics: From 0D to 3D Materials

On the Resolution Limit of Electrohydrodynamic Redox 3D Printing

Selectively Metalizable Stereolithography Resin for Three-Dimensional DC and High-Frequency Electronics via Hybrid Additive Manufacturing

High‐Resolution Printing‐Based Vertical Interconnects for Flexible Hybrid Electronics

Application of 3D and 4D Printing in Electronics

Near thermal-electric field controlled electrohydrodynamic 3D printing of high aspect ratio microstructures

Advanced Materials in 3D/4D Printing Technology

High Resolution Dual Material Stereolithography for Monolithic Microdevices