Nanoscale Analysis of Surface Bending Strain in Film Substrates for Preventing Fracture in Flexible Electronic Devices

Ryo Taguchi,Norihisa Akamatsu,Kohei Kuwahara,Kayoko Tokumitsu,Yoshiaki Kobayashi,Masayuki Kishino,Keita Yaegashi,Jun Takeya,Atsushi Shishido

DOI: https://doi.org/10.1002/admi.202001662

IF: 5.4

2021-01-25

Advanced Materials Interfaces

Abstract:<p>With the rapid development of flexible electronics and soft robotics, there is an emerging topic of preventing fracture in materials and devices integrated on largely bending film substrates of &gt;100 µm thickness. The high demand for strategically reducing strain in bending materials requires a facile method that enables one to accurately and precisely analyze the surface bending strain in a wide variety of materials. This study proposes the surface‐labeled grating method that is the fundamental and efficient technique for measuring surface bending strains merely by labeling a thin, soft grating onto various film substrates composed of flexible polymeric and rigid inorganic materials. The surface strain with a single‐nanoscale (&lt;1.0 nm) can be quantified in real time with no need of material information such as Poisson's ratio, Young's modulus, and film thickness. The fracture limit of a hard coating overlying flexible substrates is successfully determined by the accurate and precise quantification of surface bending strains. Furthermore, a multilayer film substrate with surface bending strain reduced by 50% prevents fractures of hard coatings and organic thin film transistors (OTFTs) since the strains remain below the fracture limit under large bending.</p>

materials science, multidisciplinary,chemistry