A novel homomorphic processing of ultrasonic echoes for layer thickness measurement

C. Martin,J.-J. Meister,M. Arditi,P.-A. Farine
DOI: https://doi.org/10.1109/78.143454
IF: 4.875
1992-07-01
IEEE Transactions on Signal Processing
Abstract:A homomorphic signal processing method for accurate thickness measurement of thin layers is presented. The method consists in taking the envelope of the inverse Fourier transform of a corrected logarithmic derivative of the energy spectrum (ES) of the measured signal. Simulations show excellent agreement between estimated and actual values. The method is validated by in vitro experiments at 10 MHz on Teflon films, where thicknesses down to 50 mu m are recovered, and preliminary in vivo results on arterial wall thickness estimates are presented.<>
engineering, electrical & electronic
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