Abstract:Graphene offers exceptional properties, such as ultra-high carrier mobility, near-ballistic transport characteristics, and ultra-high-frequency operational response, making it an ideal material for radio-frequency devices and high-speed optical communications. To realize its potential applications, high-quality graphene films must be integrated onto target substrates with reliability, uniformity, and scalability. Despite significant progress in the chemical vapor deposition of high-quality graphene on catalytic metal substrates, the transfer of such films onto application-targeted substrates remains necessary for large-scale technological use, but it faces challenges like contaminations and cracks. Graphene's flexibility and single-atom thickness make it vulnerable to damage and folding during the transfer process due to force disturbances and uneven force distribution. Traditional graphene transfer methods employ organic polymers as a medium and remove them using organic solvents after transferring graphene onto the desired substrates. However, this repetitive process generates organic waste and leaves unavoidable contamination due to the limited solubility of the polymer. Furthermore, selective interlacing of organic solvents during polymer removal can detach graphene from the substrate and cause cracks. In this study, we demonstrate a novel approach to address these issues. Instead of using organic polymers, we directly use the photoresist as the transfer medium to mechanically delaminate graphene from the metal growth substrate onto the targeted substrate. By doing so, we eliminate the need for repeated polymer coating on the graphene surface, enabling successful transfer without crack formation, wrinkles, or unintentional doping. The strong interaction between graphene and the photoresist, coupled with the weakened interaction between graphene and the growth substrate due to oxidation, ensures crack-free delamination. Moreover, the photoresist serves as a patterned mask plate for exposure, etching, and other subsequent device fabrication processes. As a result, the electrical properties of graphene are improved, achieving an average carrier mobility of 6200 cm(2)center dot V-1 center dot s(-1). This integrated approach not only enhances the device performance of two-dimensional materials but also paves the way for future applications of such materials in electronics and photonics. In conclusion, our method offers a promising solution for the successful transfer and device fabrication of graphene, enhancing its potential in the field of electronics and photonics.

Damage-free transfer mechanics of 2-dimensional materials: competition between adhesion instability and tensile strain

Scalable and Versatile Transfer of Sensitive Two-dimensional Materials

Damage-free dry transfer method using stress engineering for high-performance flexible two- and three-dimensional electronics

Damage-free and Rapid Transfer of CVD-grown Two-Dimensional Transition Metal Dichalcogenides by Dissolving Sacrificial Water-Soluble Layers.

A Capillary-Force-Assisted Transfer for Monolayer Transition-Metal-Dichalcogenide Crystals with High Utilization

Large-area transfer of two-dimensional materials free of cracks, contamination and wrinkles via controllable conformal contact

Tunable Adhesion for All-Dry Transfer of 2D Materials Enabled by the Freezing of Transfer Medium

Highly Accurate, Reliable and Non-Contaminating Two-Dimensional Material Transfer System

N-graphdiyne Two-Dimensional Nanomaterials: Semiconductors with Low Thermal Conductivity and High Stretchability

Strategy for transferring van der Waals materials and heterostructures

Thin-suspended 2D Materials: Facile, Versatile, and Deterministic Transfer Assembly

Mechanical Exfoliation of Two-Dimensional Materials

Plasticity and ductility in graphene oxide through a mechanochemically induced damage tolerance mechanism

Crack-Free Transfer of Graphene Wafers Via Photoresist As Transfer Medium

Interfacial Stress Transfer and Fracture in van der Waals Heterostructures

Mechanical, Elastic, and Adhesive Properties of Two‐Dimensional Materials: From Straining Techniques to State‐of‐the‐Art Local Probe Measurements

Universality of strain-induced anisotropic friction domains on 2D materials

A facile direct device transfer of monolayer MoS2 towards improvement in transistor performances

Facile fabrication of 2D material multilayers and vdW heterostructures with multimodal microscopy and AFM characterization

High-Fidelity Transfer of Chemical Vapor Deposition Grown 2D Transition Metal Dichalcogenides Via Substrate Decoupling and Polymer/Small Molecule Composite.

Minimizing Residues and Strain in 2D Materials Transferred from PDMS