Electrodeposition of Platinum Metal and Platinum-Rhodium Alloy on Titanium Substrates

A. Baraka,H.H. Shaarawy,H.A. Hamed
DOI: https://doi.org/10.1361/105994903770343402
IF: 2.3
2003-02-01
Journal of Materials Engineering and Performance
Abstract:A method for application of an adherent platinum (Pt) and platinum-rhodium (Pt-Rh) alloy plate to a titanium (Ti) substrate includes steps of surface pretreatment, anodization, and electrodeposition of Pt and Pt-Rh alloy from their electrolytic baths consisting of H2Pt2Cl6·6H2O (20 gL−1), and HCl (300 gL−1) for a Pt bath. The Pt-Rh bath consists of H2Pt2Cl6·6H2O (20 gL−1), and HCl (300 gL−1) and Rh2 (SO4)3 (2 gL−1). At the optimum conditions of electroplating, the Pt and Pt-Rh deposits were formed over the anodized Ti substrates with high adhesion, brightness, and high current efficiency (35.33% for Pt and 70.38% for the Pt-Rh alloy).
materials science, multidisciplinary
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