Texture and grain boundary engineering in electrodeposited SnCu coatings and its effect on coating corrosion behaviour

Abhay Gupta,Chandan Srivastava
DOI: https://doi.org/10.1080/14786435.2021.1949067
2021-07-11
Abstract:SnCu coatings (Cu between 0–33.0 at.%) were electrodeposited over mild steel. Corrosion analysis was performed over mirror polished SnCu coatings to remove surface morphology effect. Highest corrosion resistance was observed for the SnCu coating with ∼21.2 at.% Cu and lowest corrosion resistance was observed for the SnCu coating with ∼9.9 at.% Cu. Sn-rich phase and Cu<sub>6</sub>Sn<sub>5</sub> intermetallic were present in all the coatings. For lower Cu content (∼6.0 at.% Cu), a significant fraction of Cu was found to be incorporated into the Sn rich solid solution phase, thus increasing strain within the grains. As the Cu content increased, the Cu<sub>6</sub>Sn<sub>5</sub> phase formed predominantly at the Sn-rich phase grain boundaries. For the Sn rich phase, a preferred crystallographic orientation along the (001) was observed in SnCu coating with lower Cu content (Cu &lt; 10 at.%). On the other hand, at high Cu content (Cu &gt; 20 at.%), the low surface energy (100) texture was dominant. Addition of Cu decreased the Sn-rich phase grain size. The SnCu coating with ∼21.2 at.% Cu exhibited highest fraction of low angle grain boundaries (LAGBs) and low energy <span class="NLM_disp-formula inline-formula"><math>(031)[01¯3]</math></span> twin boundaries. It was established that the presence of low surface free energy (100) atomic planes exposed to corrosive medium, a high fraction of LAGBs, and low energy <span class="NLM_disp-formula inline-formula"><math>(031)[01¯3]</math></span> twin boundaries yields high corrosion resistance for SnCu coating with 21.2 at.% Cu, while a strong (001) texture and high strain within the grains, increased the corrosion susceptibility of the SnCu coating with ∼9.9 at.% Cu.
materials science, multidisciplinary,physics, applied, condensed matter,metallurgy & metallurgical engineering
What problem does this paper attempt to address?