Numerically Calculated Thermal Resistance At Perovskite-Bismuth Telluride Interface

,,,,,Shotaro MIYAMOTO,Shoya KAWANO,Satoshi IIKUBO,Tomohide YABUKI,Koji MIYAZAKI
DOI: https://doi.org/10.1299/jsmekyushu.2021.74.b35
2021-01-01
The Proceedings of Conference of Kyushu Branch
Abstract:We numerically calculated the thermal boundary resistance between Halide perovskite and Bismuth telluride using Diffuse Mismatch Model (DMM) using the full phonon dispersion relationship over the entire Brillouin zone. The phonon properties of both materials are calculated by using VASP and Phonopy, and the validity is confirmed by comparing with the reported values. The calculated phonon thermal conductivities are also agreed with the measured results. The probability of transmission at the interface is calculated the phonons group velocities depending on wave vectors. It is well known that the linear dispersion relationship in DMM calculation is not enough for understanding the interfacial thermal resistance at higher temperature than Debye temperature. We investigated that the effects of both the crystal direction and crystal structure of Halide perovskite on the interfacial thermal resistance. The Bismuth telluride crystal directions is fixed to c-axis for the simplicity. When the Halide perovskite is orthorhombic in c-axis direction, the calculated interfacial thermal resistance is the highest. The value is about twice higher than the lowest thermal resistance. The calculated boundary resistances are one or two order higher than that of Metal-Metal thermal resistance due to the very low phonon group velocity of the perovskite. The higher interfacial thermal resistance is preferable to obtain the lower thermal conductivity of the composite. The interfacial thermal resistance can be useful to improve the effective thermoelectric properties.
What problem does this paper attempt to address?