Abstract:Pure copper is very soft, however, hardening the pure copper with most strengthening mechanisms leads to a significant reduction in electrical conductivity. Grain refinement is a better strengthening mechanism to maintain high enough electrical conductivity. Plastic deformation at room temperature followed by post-annealing is one of the best methods to achieve fine-grained metals and alloys. In this research, the high-temperature annealing behavior of cold-rolled electrolytic tough-pitch (ETP) copper sheets was studied. 90 % asymmetric cold rolling followed by high-temperature post-annealing at 673 K for 1, 2, 5, 10, 30, 60, and 120 min were applied on the copper. The microstructure was significantly changed with increasing annealing time from 1 to 2 min owing to full recrystallization. With increasing the annealing duration, the grain size is increased. The formation of equiaxed grains with a smaller size (∼9 μm) compared to the full-annealed (initial) sample (∼68 μm) is observed after the longest time of post-annealing (120 min) due to the pinning effect of Cu2O particles. The post-annealed copper sheets processed by asymmetric rolling (in this work) exhibited a more homogeneous microstructure through the thickness compared to the symmetric rolling due to more uniform stored strain energy. The results showed that the first deformed grains that undergo recrystallization during post-annealing are Goss-oriented grains. With an increase in the post-annealing time, the S and Copper components were eliminated and a strong Cube and P texture orientations were formed. Interestingly, after 1 min of post-annealing, the yield and tensile strength enhanced to 410.2 MPa and 418.6 MPa owing to the annealing hardening phenomenon. The hardness and strength reached a constant value after the post-annealing for 10 min and above. With increasing the post-annealing duration, the central area of fracture surfaces (consisting of ductile dimples) became larger and the outer region (consisting of flat surfaces and shear dimples) became smaller, showing a shift towards perfect ductile fracture. With the increase of post-annealing time from 1 min to 120 min, the electrical conductivity was increased from 77.6 to 97.5 %IACS. The presence of the Cube texture increased the electron mobility compared to the P orientation, by reducing the mean distance that they can travel without scatter. From the obtained results, it can be concluded that the asymmetric cold rolling followed by high-temperature post-annealing is capable of strength improvement and maintaining electrical conductivity in copper.

Influence of cold rolling and annealing on the microstructure, mechanical properties, and electrical conductivity of an artificial microcomposite Cu-18% Nb alloy

Reforming Nanostructured CuAg Alloy to Improve Ductility and Electrical Conductivity

Effect of annealing processes on microstructure, mechanical properties and conductivity of Cu-12%Ag alloy composite-reinforced by fibers

Effect of cryogenic rolling and intermediate aging on mechanical reinforcement of the Cu-Fe-Nb composites

Progress and Current Status in Research on Nanostructured Cu-Ag Microcomposites for Conductor Wires

Microstructure and Properties of Cold Drawing Cu-2.5% Fe-0.2% Cr and Cu-6% Fe Alloys

Microstructure and mechanical properties of high-temperature free-oxygen rolled Cu/1060Al bimetallic composite materials

Microstructure, mechanical properties and electrical conductivity of Cu–12wt.% Fe microcomposite annealed at different temperatures

Microstructure and mechanical properties of a Cu-Fe-Nb alloy with a high product of the strength times the elongation

Relationships between mechanical strength and electrical conductivity for Cu–Ag filamentary microcomposites

Influence of Nb Morphology on the Structure and Properties of High Strength and High Conductivity Cu-Nb Composite Wires

Effects of Cold Rolling Reduction Rate on the Microstructure and Properties of Cu-1.16Ni-0.36Cr Alloy after Thermo-Mechanical Treatment

Effect of cold rolling on microstructure and mechanical properties of a Cu–Zn–Sn–Ni–Co–Si alloy for interconnecting devices

Effect of Cold Rolling on Microstructure and Mechanical Properties of a Cast TiNbZr-Based Composite Reinforced with Borides

Mechanical Properties and Microstructure Evolution of Cold-Rolled Nano-Ni/Graphene Oxide Composite Foil

Effect of annealing temperature on microstructure and tensile properties of copper/aluminum composite thin strip

Influence of cold rolling process on microstructure and mechanical properties of Cu-1.5%Ti alloy

Microstructural evolution and mechanical property of Cu‐Cr‐Zr‐ZrB2 composites subjected to cryorolling and aging treatment

Effect of Annealing on the Interface and Microstructural Properties of Al/Cu Composites Processed by Hot Pressing and Subsequent Cold Rolling

Effect of Cold and Warm Rolling on the Particle Distribution and Tensile Properties of Heterogeneous Structured AlN/Al Nanocomposites

High-temperature annealing behavior of cold-rolled electrolytic tough-pitch copper