Extreme creep resistance in a microstructurally stable nanocrystalline alloy

K. A. Darling,M. Rajagopalan,M. Komarasamy,M. A. Bhatia,B. C. Hornbuckle,R. S. Mishra,K. N. Solanki
DOI: https://doi.org/10.1038/nature19313
IF: 64.8
2016-09-01
Nature
Abstract:A nanocrystalline copper–tantalum alloy with high strength and extremely high-temperature creep resistance is achieved via a processing method that creates clusters of atoms within the alloy that pin grain boundaries.
multidisciplinary sciences
What problem does this paper attempt to address?