Stabilizing nanoprecipitates in Al-Cu alloys for creep resistance at 300°C

Y. H. Gao,C. Yang,J. Y. Zhang,L. F. Cao,G. Liu,J. Sun,E. Ma
DOI: https://doi.org/10.1080/21663831.2018.1546773
2018-11-19
Materials Research Letters
Abstract:Commercial precipitation-hardened Al-Cu alloys are normally used at temperatures below its ageing temperature of ∼225°C, to avoid thermally induced precipitate coarsening and resultant softening. Making such popular Al alloys creep resistant at or above 300°C is thus challenging. Here we present a modified precipitation protocol, exploiting Sc-microalloying and a carefully designed three-step heat treatment to enhance Sc segregation at the matrix/θ′-Al2Cu precipitate interfaces. The stabilized nanoprecipitates enable an order-of-magnitude reduction in creep rate at 300°C, demonstrating the room for microstructure improvement and the potential for property elevation in traditional engineering alloys through innovative processing coupled with synergetic alloying elements. A carefully designed precipitation protocol produces stable nanoprecipitates in Sc-microalloyed Al-Cu alloys, rendering an order-of-magnitude elevation of creep resistance at 300°C.
materials science, multidisciplinary
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