Transient Liquid Phase Bonding of ZGH451 Superalloy Fabricated by Directed Energy Deposition
Xingyu Hou,Xindong Qin,Yuan Sun,Shiyang Wang,Hongyu Zhang,Hongwei Zhang,Chuanyong Cui,Zhuqing Wang,Shiwei Liu,Jinguo Li,Yizhou Zhou
DOI: https://doi.org/10.1002/adem.202401433
IF: 3.6
2024-10-16
Advanced Engineering Materials
Abstract:A Ni‐based interlayer alloy is designed for transient liquid phase bonding of ZGH451 superalloy produced through directed energy deposition. Joints with a controlled gap within the range of 0–30 μm achieve complete isothermal solidification, exhibiting up to 1375 MPa tensile strength at room temperature and 983 MPa at 760 °C. Notably, the interlayer alloy developed in this study outperforms the conventional BNi‐2. ZGH451, a directionally solidified Ni‐based superalloy designed for additive manufacturing, has garnered significant attention in the realm of next‐generation turbine blades. Welding the ZGH451 superalloy is crucial for promoting its practical application. In this study, transient liquid phase (TLP) bonding is applied to weld ZGH451 superalloy produced through directed energy deposition. A Ni‐based interlayer alloy powder is developed and prepared via thermodynamic calculation, with the interlayer subsequently characterized using differential thermal analysis. TLP bonding is conducted at 1200 °C for 4 h. The influence of the preset gap on the joint microstructure and mechanical properties is examined. The microstructure of the TLP bonding joints comprises athermally solidified zones (ASZ), isothermally solidified zones, and diffusion‐affected zones. The ASZ width significantly increases with the growing preset gap. A preset gap not exceeding 100 μm enables complete isothermal solidification of the joints. Particularly, joints with a preset gap ranging from 0 to 30 μm demonstrate optimal reliability, exhibiting a tensile strength of up to 1375 MPa at room temperature, which is 12% higher than the room temperature strength of the base metal (BM), and a tensile strength of 983 MPa at 760 °C, surpassing 86% of the BM's strength at the same temperature.
materials science, multidisciplinary