Ultrathin flexible heat pipes with Microsorum fortunei structural-like wick for cooling flexible electronic devices

Yalong Sun,Fuye Liang,Heng Tang,Yong Tang,Shiwei Zhang,Kian Jon Chua
DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2022.123743
IF: 5.2
2022-12-10
International Journal of Heat and Mass Transfer
Abstract:Ultrathin flexible heat pipes (FHP) with Microsorum fortunei structural-like wicks were fabricated to meet the cooling demands of flexible electronics. The biomimetic wick was fabricated by high-temperature sintering and composed of multi-layer copper mesh and porous micropillars, which corresponded to the veins and spores of Microsorum fortunei leaves, respectively. The aluminum-plastic film was adopted as the casing and endowed the FHPs with insulating capability. FHPs with the thickness of 0.8 mm and 0.67 mm were fabricated by regulating the height of the porous micropillars to form vapor channels with different thicknesses, which reached the maximum thermal conductivity of 1943.5 W/m·K and 1449.5 W/m·K under heating power of 17.1 W and 8.1 W, respectively. The optimum filling ratio was found to be 100% due to its higher thermal conductivity under lower heating powers. FHPs with Microsorum fortunei structural-like wicks achieved good bending heat transfer performances while incurring thermal conductivity fluctuation to within 5.3% under 0–180° bending angles. The infrared tests highlighted that the FHPs maintained good heat transfer performance under natural convection conditions. The advantages of simple manufacture coupled with good bending heat transfer performance and insulating made the FHPs with Microsorum fortunei structural-like wick highly suitable for thermal management of flexible electronics.
engineering, mechanical,thermodynamics,mechanics
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