Half-Heusler alloys as emerging high power density thermoelectric cooling materials

Hangtian Zhu,Wenjie Li,Amin Nozariasbmarz,Na Liu,Yu Zhang,Shashank Priya,Bed Poudel
DOI: https://doi.org/10.1038/s41467-023-38446-0
IF: 16.6
2023-06-06
Nature Communications
Abstract:Abstract To achieve optimal thermoelectric performance, it is crucial to manipulate the scattering processes within materials to decouple the transport of phonons and electrons. In half-Heusler (hH) compounds, selective defect reduction can significantly improve performance due to the weak electron-acoustic phonon interaction. This study utilized Sb-pressure controlled annealing process to modulate the microstructure and point defects of Nb 0.55 Ta 0.40 Ti 0.05 FeSb compound, resulting in a 100% increase in carrier mobility and a maximum power factor of 78 μW cm −1 K −2 , approaching the theoretical prediction for NbFeSb single crystal. This approach yielded the highest average zT of ~0.86 among hH in the temperature range of 300-873 K. The use of this material led to a 210% enhancement in cooling power density compared to Bi 2 Te 3 -based devices and a conversion efficiency of 12%. These results demonstrate a promising strategy for optimizing hH materials for near-room-temperature thermoelectric applications.
multidisciplinary sciences
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