Flow Modulation Epitaxy of Thick Boron Nitride Epilayers and Wafer-Level Exfoliation

Yiwei Duo,Qichao Yang,Lulu Wang,Yijian Song,Ziqiang Huo,Junxue Ran,Jiankun Yang,Junxi Wang,Tongbo Wei
DOI: https://doi.org/10.1021/acs.cgd.3c01309
IF: 4.01
2024-01-03
Crystal Growth & Design
Abstract:Uniform and continuous wafer-level sp2-hybridized boron nitride (sp2-BN) is essential for the development of other III-nitride semiconductors in alleviating lattice mismatch and constructing flexible devices. In this work, we realize wafer-level thick sp2-BN on 2 in. c-plane sapphire with a flow modulation epitaxy (FME) method by metal–organic chemical vapor deposition (MOCVD). It is revealed that the pulsed ammonia and triethylboron interruptions greatly improve the surface morphology and crystalline quality of sp2-BN, attributed to the unintentional nitridation, the decrease of C impurity concentration, and the increase of B atom surface mobility. The root-mean-square roughness of 6.5 nm sp2-BN is only 1.6 nm, and the full width at half-maximum of the Raman spectrum is only 31.18 cm–1. Besides the flat morphology with uniform wrinkles, a well-ordered layered sp2-BN structure with a lattice spacing of 0.34 nm is also revealed. Furthermore, thick sp2-BN demonstrates controllable exfoliated characteristics due to a weak interfacial force. These findings highlight the comprehension of the growth behavior and exfoliated characteristics of sp2-BN on the sapphire substrate and provide opportunities for flexible nitride devices in mass production.
chemistry, multidisciplinary,materials science,crystallography
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