Low-temperature direct diffusion bonding of Zr-4 alloy via hydrogenation

Yao Wang,Yuanxing Li,Hui Chen,Yujie Bai,Yi Liu,Zongtao Zhu
DOI: https://doi.org/10.1016/j.jallcom.2023.170433
IF: 6.2
2023-05-08
Journal of Alloys and Compounds
Abstract:Reliable low-temperature bonding of Zr-4 alloy is crucial for the safe run of nuclear reactors because the high temperature damages the performance of Zr-4 alloy. The hydrogenated Zr-4 alloy containing 0.2 wt% hydrogen was formed by gaseous hydrogen charging at 700 °C for 2 h and was subsequently used to facilitate the diffusion bonding of Zr-4 alloy. The effect of hydrogen and bonding temperature (600–700 °C) on the microstructure and phase composition were investigated by electro channeling images (ECCI) and transmission electron microscopy (TEM). The repeatable results indicated that, diffusion bonding of Zr-4 alloy was successfully realized at low temperature of 650 °C for 60 min under a pressure of 15 MPa. The bonding temperature was about 150 °C lower than the bonding temperature (800 °C) required in bonding of Zr-4 alloy without hydrogen charging treatment. The joint had highest room temperature shear strength was when bonding at 700 °C, which increased by 367% relative to the shear strength (55 ± 7 MPa) of the joint welded without hydrogen charging treatment at same temperature.
materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
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