Simulation‐Directed Construction of Bamboo‐Forest‐Like Heat Conduction Networks to Enhance Silicon Rubber Composites' Heat Conduction Properties
Dongliang Ding,Xu Wang,Ruoyu Huang,Zhenyu Wang,Gaoxiao Jiang,Linfeng Yu,Haitao Nie,Xiaoliang Zeng,Biao Tang,Guangzhao Qin,Xue‐Ao Zhang,Qiuyu Zhang,Jianbin Xu,Yanhui Chen
DOI: https://doi.org/10.1002/smll.202406229
IF: 13.3
2024-09-14
Small
Abstract:Inspired by the water transport and transpiration of bamboo forests, a bamboo‐forest‐like heat conduction network is rationally designed and fabricated under the guidance of multiphysics simulations, which can rapidly exchange heat with matrix, thereby endowing the composites with outstanding heat conduction capabilities, resulting in SiR composites' through‐plane thermal conductivity and thermal diffusivity reaching up to 6.47 W (mK)−1 and 3.98 mm2 s−1, respectively. Highly vertically thermally conductive silicon rubber (SiR) composites are widely used as thermal interface materials (TIMs) for chip cooling. Herein, inspired by water transport and transpiration of Moso bamboo‐forests extensively existing in south China, and guided by filler self‐assembly simulation, bamboo‐forest‐like heat conduction networks, with bamboo‐stems‐like vertically aligned polydopamine‐coated carbon fibers (VA‐PCFs), and bamboo‐leaves‐like horizontally layered Al2O3(HL‐Al2O3), are rationally designed and constructed. VA‐PCF/HL‐Al2O3/SiR composites demonstrated enhanced heat conduction properties, and their through‐plane thermal conductivity and thermal diffusivity reached 6.47 W (mK)−1 and 3.98 mm2 s−1 at 12 vol% PCF and 4 vol% Al2O3 loadings, which are 32% and 38% higher than those of VA‐PCF (12 vol%) /SiR composites, respectively. The heat conduction enhancement mechanisms of VA‐PCF/HL‐Al2O3 networks on their SiR composites are revealed by multiscale simulation: HL‐Al2O3 bridges the separate VA‐PCF heat flow channels, and transfers more heat to the matrix, thereby increasing the vertical heat flux in composites. Along with high volume resistivity, low compression modulus, and coefficient of thermal expansion, VA‐PCF/HL‐Al2O3/SiR composites demonstrate great application potential as TIMs, which is proven using multiphysics simulation. This work not only makes a meaningful attempt at simulation‐driven biomimetic material structure design but also provides inspiration for the preparation of TIMs.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology