Development of Al-25Si-xCe Alloy with High Conductivity and Low Expansivity for Thermal Management Purpose

Xin Shang,Yongxing Li,Zirong Zhou,Chengqian Zhong,Lingzhi Xie,Lijuan Pang,Wen Yin
DOI: https://doi.org/10.1007/s11665-024-09511-6
IF: 2.3
2024-05-09
Journal of Materials Engineering and Performance
Abstract:Nowadays, the power density of the precise integrated circuit is sharply increasing, improving the thermal conductivity of the electronic packaging materials is becoming more and more important. The aluminum alloys with high silicon content (such as Al-50Si) are becoming more and more popular in electronic packaging field due to their low cost and lightweight. But their thermal conductivities are needed to be promoted. In the present work, the cerium with different dosages ( x Ce = 5-20 wt.%) is introduced in to the Al hyper-eutectic alloy with 25 wt.% silicon. The addition of cerium is helpful to decrease the melting point of the Al-25Si alloy, which is favorable to save the processing cost. The thermal conductivity of this alloy is not lower than 100 W/(m K), which is close to the eutectic Al-Si alloy. From 25 to 200 °C, the coefficient of thermal expansion (CTE) of the Al-25Si-20Ce alloy is about 15-16 ppm/K. The relatively high thermal conductivity of the Al-25Si- x Ce alloys is due to the addition of rare earth is favorable to the refinement of primary silicon phase. This study provides a design strategy toward the electronic packaging materials.
materials science, multidisciplinary
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