Abstract:The upcoming Belle II experiment is designed to work at a luminosity of 8 x 10(35) cm(-2) s(-1), 40 times higher than its predecessor. The pixel detector of Belle II with its similar to 8 million channels will deliver ten times more data than all other sub-detectors together. A data rate of 22 Gbytes/s is expected for a trigger rate of 30 kHz and an estimated pixel detector occupancy of 3 %, which is by far exceeding the specifications of the Belle II event builder system. Therefore a realtime data reduction of a factor >30 is needed.A hardware platform capable of processing this amount of data is the ATCA based Compute Node (CN). Each CN consists of an xTCA carrier board and four AMC/mu TCA daughter-boards. The carrier board supplies the high bandwidth connectivity to the other CNs in the shelf via Rocket-IO links. In the current prototype design, each AMC board is equipped with a Xilinx Virtex5FX70T FPGA, 4 GB of memory, Gbit Ethernet and two bi-directional optical links allowing for high data transfer rates. IPMI control of mother-and daughter-board is foreseen. One ATCA shelf containing 10 motherboards/40 daughter-boards is sufficient to process the data from the 40 front end boards.The data reduction on the CN is done in two steps. First, the data delivered by the front end electronics via optical links has to be stored in memory until the high level trigger (HLT) decision has been made. This might take, depending on the event topography, up to seconds. This decreases the event rate by a factor >3. In a second step, pixel data of positively triggered events is reduced with the help of regions of interest (ROI), calculated by the HLT from projecting trajectories back to the pixel detector plane. The design allows additional ROI inputs computed from SVD tracklet data as well as from hit cluster properties. The final data reduction is achieved by sending only data within these ROIs to the main event builder.

Design of the OBELIX monolithic CMOS pixel sensor for an upgrade of the Belle II vertex detector

Upgrade of Belle II vertex detector with CMOS pixel technology

DEPFET Active Pixel Sensors for the Belle II Experiment

A Full Functional Monolithic Active Pixel Sensor Prototype for the CEPC Vertex Detector

The Belle Ii Pixel Detector Data Acquisition And Reduction System

The Belle II DEPFET vertex detector: current status and future plans

Development of CMOS Pixel Sensors fully adapted to the ILD Vertex Detector Requirements

Development of Fast and High Precision CMOS Pixel Sensors for an ILC Vertex Detector

DEPFET pixels as a vertex detector for the Belle II experiment

Beyond the CMOS sensors: the DoTPiX pixel concept and technology for the International Linear Collider A

High-Voltage Pixel Sensors for Atlas Upgrade

Performance of CMOS pixel sensor prototypes in ams H35 and aH18 technology for the ATLAS ITk upgrade

Design and Performance of HV CMOS Sensors for Future Colliders by the RD50 Collaboration

Subpixel Mapping and Test Beam Studies with a HV2FEI4v2 CMOS-Sensor-Hybrid Module for the ATLAS Inner Detector Upgrade

Developing a Monolithic Silicon Sensor in a 65 nm CMOS Imaging Technology for Future Lepton Collider Vertex Detectors

Silicon Vertex Detector of the Belle II Experiment

Front-end electronic readout system for the Belle II imaging Time-Of-Propagation detector

CMS Pixel Detector Upgrade

High data-rate readout logic design of a 512 × 1024 pixel array dedicated for CEPC vertex detector

A TPC-based tracking system for a future Belle II upgrade