High-k polymer dielectrics with different cross-linked networks for nonvolatile transistor memory device

Xiaosong Wu,Donghuan Dai,Wei Huang,Shiyu Feng,Weiguo Huang
DOI: https://doi.org/10.1016/j.orgel.2021.106222
IF: 3.868
2021-09-01
Organic Electronics
Abstract:<p>Nonvolatile OFET memory devices using different pPFPA/<em>b</em>PEI cross-linked polymers as the dielectric layer are fabricated. The influence of <em>b</em>PEI content on the electrical property and memory performance of devices are systematically investigated. The results demonstrate that the introduction of <em>b</em>PEI into pPFPA can significantly enhance the capacitance and dielectric constant of the pPFPA/<em>b</em>PEI cross-linked polymer dielectrics, but it also causes a slight increase in the leakage current density. Besides, the excess <em>b</em>PEI induces more morphology defects of the semiconductor film, leading to an apparent decrement in charge mobility. Transistors with the 119:250 pPFPA/<em>b</em>PEI dielectric layer exhibit the highest on/off current ratio (∼10<sup>7</sup> at <em>V</em><sub>g</sub> = − 20V) and a relatively low hole mobility of 0.38 cm<sup>2</sup> V<sup>−1</sup>s<sup>−1</sup>. Moreover, the corresponding memory devices show good reliability in information record with a data retention time over 10<sup>5</sup> s, indicating that an appropriate amount of <em>b</em>PEI is crucial for improving the stability of the memory devices.</p>
materials science, multidisciplinary,physics, applied
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