Abstract:Significance The exponential growth of data driven by big data and artificial intelligence is propelling data centers towards larger scales. The adoption of decoupled architectures has increased the number of interconnection nodes and data exchanges within these centers, particularly in new data centers tailored for artificial intelligence where distributed training requires a considerable data exchange between GPU nodes. Minimizing communication-to-computation ratio is crucial for efficient distributed machine learning frameworks. Despite using low-power, high-bandwidth optical interconnections for node-to-node data transfer, signal switching in data centers still relies heavily on a hierarchical structure of electrical switches. These traditional switches, constrained by bandwidth and port count, are inadequate for escalating demands of data transmission. Future high-performance, large-scale, and green data centers are likely to rely on optical switches offering high bandwidth, low latency, and minimal power consumption. Among various optical switch technologies, silicon photonic switching stands out due to its nanosecond-scale switching time, ultra-low power consumption, high integration potential, and compatibility with CMOS fabrication processes. Progress Scholars have focused on innovating silicon photonic switches configured in a cascaded Mach-Zehnder Interferometer (MZI) setup ( refer to Table 1). The phase shift arm within the MZI structure, which modulates the refractive index through different mechanisms, primarily differentiates into electro-optic (EO) switches that leverage the carrier dispersion effect and thermo-optic (TO) switches that operate on thermal effects. Scaling port integration has been a central tenet in silicon photonic switch research, with advancements such as 32x32 EO switches achieved in 2017 and 64x64 TO switches in 2018, boasting rapid link switching time of approximately 1 ns. Generally, at equivalent scales, TO switches exhibit lower loss and superior crosstalk performance, while EO switches offer faster switching speeds and lower energy consumption due to their operational principles. Challenges remain in device calibration, optoelectronic hybrid packaging, and cumulative optical path loss management with network scaling, limiting the realization of largerscale silicon photonic switches. The development of large-scale silicon photonic switches hinges on key technologies such as network architecture optimization, unit device enhancement, loss compensation techniques, switch unit calibration, and optoelectronic hybrid packaging. These technologies are deeply interconnected and necessitate a balanced and integrated approach to achieve improvements. Network architecture forms the cornerstone for constructing large-scale optical switches, requiring comprehensive optimization that addresses switching path control, unit device calibration, and cumulative link loss. While unit device performance has nearly peaked, integrating III-V material devices to compensate for optical link losses poses technical challenges such as material integration and thermal management. Optoelectronic detectors or grating devices for monitoring and calibrating the switch unit states within integrated switch chips strain electrical packaging and raise practicality concerns in large-scale optical switch systems. System-level calibration methods hold promise but require validation for reliability. Optical and electrical packaging constraints present challenges during large-scale optical switch assembly, necessitating suitable optoelectronic hybrid packaging strategies considering network architecture, dimensions, optical coupling techniques, and control requirements Conclusions and Prospects The future demand for high-performance, large-scale green data centers underscores the development trajectory for silicon photonic switches. While silicon photonic technology is highly competitive in achieving low-power, large-scale optical switching devices, current loss and crosstalk performance must be further reduced to meet data center requirements. Progress in heterogeneous integration technologies, system-level unit device calibration methods, and advanced packaging technologies is expected to resolve bottleneck issues arising from increased device integration and calibration complexities. This progression paves the way for the realization of high-performance, highly integrated, and energy-efficient optical switches capable of supporting thousands of ports.

Neural Network-Based Prediction of Optical Input Power for Reliability-Aware Green Communication in Silicon Photonic Interconnects on Chip

Worst-case Power Integrity Prediction Using Convolutional Neural Network.

Optimizing Coherent Integrated Photonic Neural Networks under Random Uncertainties

Silicon Photonic Network-on-chip and Enabling Components

Reliability Modeling and Management of Nanophotonic On-Chip Networks

Machine Learning Based Optical Transmission System Link Performance Degradation Prediction and Application

Reliability-Aware Design Flow for Silicon Photonics On-Chip Interconnect

Impact of Thermal Effect on Reliability in Optical Network-on-Chip

Predictions of CMOS Compatible On-Chip Optical Interconnect

Research Progress in Silicon Optical Switching Devices(Invited)

Exploration of Neural Network-based Joint Method of Mapping and Wavelength Assignment in Optical Network-on-Chip (ONoC)

Prediction of Intermittent Failure by Presage Debacle Model in Network on Chip

A Learning-Based Thermal-Sensitive Power Optimization Approach for Optical NoCs

Simulation approach of hybrid optical-electrical on-chip interconnects for multicore systems

Efficient On-Chip Learning for Optical Neural Networks Through Power-Aware Sparse Zeroth-Order Optimization

Device Modeling and System Simulation of Nanophotonic On-Chip Networks for Reliability, Power and Performance

Analysis of Optical Loss and Crosstalk Noise in MZI-based Coherent Photonic Neural Networks

Numerical Simulation of an InP Photonic Integrated Cross-Connect for Deep Neural Networks on Chip

Powernet: SOI Lateral Power Device Breakdown Prediction with Deep Neural Networks

On-chip Optical Interconnect for Reduced Delay Uncertainty

Characterization and Optimization of Integrated Silicon-Photonic Neural Networks under Fabrication-Process Variations