Experimental and numerical investigation on turbulent convection enhancement in minichannel heat sink with staggered V-shaped pin fins

Weibo Gu Xiang Zhang Bohan Zhang Qisen Lin Zhicheng Jia Feng Liu Jingjiang Qiu Yong He Qian Li a School of Mechanics and Safety Engineering,Zhengzhou University,P.R. Chinab National Center for International Joint Research of Micro-Nano Molding Technology,Zhengzhou University,P.R. Chinac Key Laboratory for Micro Molding Technology of Henan Province,Zhengzhou University,P.R. Chinad State Key Laboratory of Fluid Power and Mechatronic Systems,Zhejiang University,Hangzhou,P.R. Chinae School of Information Engineering,Nanyang Institute of Technology,P.R. China
DOI: https://doi.org/10.1080/10407782.2024.2361474
2024-06-11
Numerical Heat Transfer Part A Applications
Abstract:With the continuous advancements in new energy vehicle technology, the insulated gate bipolar transistor (IGBT) thermal properties have a direct impact on power system reliability. In this article, a minichannel heat sink with staggered V-shaped pin fins (SVPF) is investigated through both experimental and numerical approaches. Initially, the heat transfer performance of SVPF and conventional minichannel heat sink was analyzed using the CFD numerical simulation method. Subsequently, numerical and experimental validation was carried out by assessing the Nusselt number and turbulence characteristics of SVPF. Finally, an in-depth analysis was conducted to investigate the effects of SVPF geometric parameters on the turbulent characteristics and heat transfer performance of the minichannel heat sink. The results demonstrate that SVPF exhibits superior hydrothermal performance, which could maintain better heat transfer performance while simultaneously reducing the friction factor of minichannels. These findings provide valuable insights for the design of three-dimensional pin fins minichannels heat sink.
thermodynamics,mechanics
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