Abstract:Solid-solution strengthening is an effective method to increase the mechanical strength of metal alloys. Revealing the solid-solution strengthening mechanism based on the energy profile of the dislocation motion is vital for the non-empirical development of high-strength metal alloys. This study provides detailed energy profiles (i.e., energy surfaces) of the edge dislocation gliding motion under the effect of solute atoms, as well as the atomic-scale origin of solute strengthening in face-centered cubic (FCC) Cu alloys. The maximum shear stress ( τ max ) required for the dislocation to leave the solute atoms (Ni, Co, and Mo, all with different sizes and stacking fault effects) was qualitatively evaluated by finite temperature molecular dynamics simulations. By the nudged elastic band (NEB) analysis, we determined the atomistic origin of the energy barrier for the edge dislocation motion and the maximum force required to overcome the solute pinning effect (i.e., depinning force, F NEB ) in binary Cu alloys. By linking F NEB to the size misfit, a theoretical prediction model based on size effects and the volumetric strain field was used and can qualitatively explain the increment in the maximum shear stress (Δ τ max ) by the solute atoms. These results provide an atomistic basis for the prediction of the solute-strengthening effect correlated with the edge dislocation motion in wide FCC systems.

Solute-enhanced twin boundary migration in CuAg alloy

In Situ Atomistic Observation of Grain Boundary Migration Subjected to Defect Interaction

Mechanical Behavior of Nanotwinned Cu–Ag Alloys with Solute Atomic Gradient Analysis Under the Influence of Twinning Spacing

Interactions Between Dislocations and Penta-Twins in Metallic Nanocrystals

Simulation Study on the Mechanical Behavior of Copper–Silver Alloy with Twinning-Induced Gradient Segregation

Alloying induces directionally-dependent mobility and alters migration mechanisms of faceted grain boundaries

Atomic-scale investigation of interactions between Cu solute and defects in Zr alloys

Concentration-temperature superposition principle for grain boundary migration in Ni(Cu) bicrystals

Atomistic simulation on the transformation behaviour of structural units at Σ27 tilt grain boundary

An atomistic study of the thermal and anti-thermal behavior of incoherent twin step migration under an elastic energy driving force

Effect of Cu and Mg co-segregation on the strength of the Al grain boundaries: A molecular dynamics simulation

Effects of alloying elements on the cohesion of {101¯1} twin boundary from first-principles calculations

Electronic origin of solute effects on the mobility of screw dislocation in bcc molybdenum

Morphology and mechanical properties of nanocrystalline Cu/Ag alloy

Atomistic study on effects of solute atoms on energy profile of edge dislocation mobility in FCC-Cu alloys

Solute Segregation and Pinning Effect on Lateral Twin Boundary in Magnesium

Effect of Ag and Zr solutes on dislocation emission from the Σ11(332)[110] symmetric tilt grain boundary in fcc Cu

In situ study of defect migration kinetics and self-healing of twin boundaries in heavy ion irradiated nanotwinned metals.

Atomistic modeling of interfacial segregation and structural transitions in ternary alloys

Understanding solute effect on grain boundary strength based on atomic size and electronic interaction

Molecular Dynamics Simulation of the Interaction Between Nanoscale Twin Boundaries and Partial Dislocations