Porous Absorber for Electromagnetic Radiation Suppression in Chip-Packages

Chaolong Lin,Jiaqi Xing,Da Li,Ling Zhang,Hanzhi Ma,Er-Ping Li
DOI: https://doi.org/10.1109/emcsipi49824.2024.10705439
2024-01-01
Abstract:In this paper, a low profile absorber for suppressing the electromagnetic radiation in the chip packages is proposed. The incorporation of porosity reduces the dielectric constant of the absorbing material which makes it easier to meet the impedance matching condition. Additionally, the porosity causes incident electromagnetic waves to undergo multiple reflections within the pores, effectively lengthening their propagation path within the absorber and enhancing the absorption capability. The simulated results in the chip-package model demonstrate an effective absorption of -14 dB within 20.3-29.8 GHz by adding the proposed absorber into the package. The detailed working mechanism of this structure is explained through the effective medium theory. Finally, the porous absorber is fabricated and experimental measured within a real chip-package inside a reverberation chamber, where the measured results bring out a -12 dB absorption effect covering 20-30 GHz.
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