A Miniaturized Absorber for Radiation Suppression in the Chip Package

Chaolong Lin,Jiaqi Xing,Da Li,Er-Ping Li
DOI: https://doi.org/10.1109/ISEMC58300.2023.10370448
2023-01-01
Abstract:In this page, a miniaturized absorber with ultrawide absorption band is designed and applied for radiation leakage suppression in the chip package. The proposed unit is a double-layer structure with two patterned resistive films of ITO etched on top of the dielectric substrate. The patterned layer is composed of a meandering square ring and a centric circular patch which enhances the coupling within the unit and facilitates the miniaturization of the structure. The size of the unit is <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$0.08\lambda_{\mathrm{L}}\times 0.08\lambda_{\mathrm{L}}(\lambda_{\mathrm{L}}$</tex> is the wavelength in the free space of the lowest absorption frequency). When the periodic boundary condition is set in the simulation, it shows a broad absorption band <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(\mathrm{S}_{11}\leq-10\text{dB})$</tex> covering 23.8-40 GHz. This unit is then used as a square ring structure for radiation suppression in chip package which demonstrates a −10dB bandwidth within 25.5-39.5 GHz.
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