Influence of Copper Substrate Microstructure on the Wettability of Sn-Based Brazing Materials

Yibo Hu,Jieshi Chen,Shuiquan Tang,Liankai Zhang,Zhixin Hou,Xinyu Wang
DOI: https://doi.org/10.1109/icept63120.2024.10668424
2024-01-01
Abstract:Electronic products continue to evolve towards miniaturization, lightness, and high performance, thus setting higher standards for microelectronic packaging technology. The wettability of solder on the substrate surface typically affects the quality and lifespan of solder joints. As a cutting-edge precision manufacturing technology, femtosecond laser can create various micro-nano composite structures on material surfaces. Therefore, three types of micro-structures were prepared using femtosecond laser, and the impact of variations in microstructure pattern spacing and shape on wettability was analyzed. The study found that the wetting angle was smallest on the circular structure, and as the spacing increased, the wetting angle consistently showed a trend of initially increasing and then decreasing. These intriguing findings offer new perspectives for future analysis of wettability.
What problem does this paper attempt to address?