SF6-Epoxy Foam Insulation Material with Ultra-Low Dielectric Loss: Morphological and Performance Control

Wenshuang Zhang,Zhicheng Wu,Yizhou Jiao,Xiang Li,Qinhao Bu,Qiaogen Zhang
DOI: https://doi.org/10.1109/ichve61955.2024.10676141
2024-01-01
Abstract:As a lightweight insulation material, epoxy resin foam is widely used in the internal insulation layer of various types of composite insulation equipment. This article uses supercritical foaming technology to prepare SF 6 -epoxy foam materials for the first time. The cell structure parameters are controlled from three aspects: epoxy matrix pre-curing degree, foaming temperature, and foaming pressure. Subsequently, the dielectric properties of foam materials with different porosity were tested, and it was found that the dielectric constant and dielectric loss decreased significantly with the increase of porosity.
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