Microstructural Evolution, Mechanical Properties and Superelasticity Behavior in Ultrasonic Spot Welding NiTi with Cu Interlayer

Zhiyuan Xu,Yansong Zhang
DOI: https://doi.org/10.1016/j.matchar.2024.114336
IF: 4.537
2024-01-01
Materials Characterization
Abstract:The microstructural evolution of NiTi shape memory alloy (SMA) with Cu interlayer joints fabricated by ultrasonic spot welding (USW) was thoroughly investigated using transmission electron microscopy (TEM) and Transmission Kikuchi Diffraction (TKD). Furthermore, an analysis was conducted on how these microstructural changes influence the behavior of superelasticity. Significant plastic deformation and element diffusion occur during the USW process, leading to the formation of dislocation entanglements, Ti(Ni0.5Cu0.5), Ni3-xCuxTi phases, and NiTiCu2O4 nano-oxide in the vicinity of the interface. According to high-resolution transmission electron microscopy (HRTEM) results, there exists a crystallographic orientation relationship (ORs) between Cu and Ti(Ni0.5Cu0.5): [011]Cu//[100]Ti(Ni0.5Cu0.5). Additionally, semi-coherent interfaces form at Cu/Ti(Ni0.5Cu0.5) and NiTiCu2O4/R-phase interfaces. However, during cyclic tensile testing, the deterioration of superelastic response in NiTi joints is primarily attributed to the hindrance caused by the USW-induced room-temperature stabilized martensite, dislocation entanglements, and NiTiCu2O4 during martensite reverse transformation. hic orientation relationship (ORs) between Cu and Ti (Ni0.5Cu0.5): [011]Cu//[100]Ti(Ni0.5Cu0.5). Additionally, semi-coherent interfaces form at Cu/Ti(Ni0.5Cu0.5) and NiTiCu2O4/R-phase interfaces. However, during cyclic tensile testing, the deterioration of superelastic response in NiTi joints is primarily attributed to the hindrance caused by the USW-induced room-temperature stabilized martensite, dislocation entanglements, and NiTiCu2O4 during martensite reverse transformation.
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