The Influence of Adjustable Ring-Mode Laser on the Formation of Intermetallic Compounds and Mechanical Properties of Ultra-Thin Al-Cu Lap Welded Joints

Wucheng Li,Hao Dong,Bin Zhang,Shuangyang Zou,Weidong Mu,Yan Cai

DOI: https://doi.org/10.1016/j.jmatprotec.2024.118537

IF: 6.3

2024-01-01

Journal of Materials Processing Technology

Abstract:Aluminum-copper dissimilar welding is a highly demanded connection process; however, welding defects and the excessive growth of intermetallic compounds (IMCs) cause pose challenges for its application. This study uses an adjustable ring-mode (ARM) laser technology to achieve lap welding of ultra-thin Al-Cu plates. Lap-welding experiments were conducted using three laser modes—fixed core power, fixed ring power, and varying welding speed—to investigate the evolution of material mixing, intermetallic compound distribution, and joint strength under different modes. Our results indicate that the high energy density of the core laser is beneficial for increasing the penetration depths of joints, whereas the large action area of the ring laser is beneficial for improving the stabilities of melt pools. The joint action of the adjustable ring-mode (ARM) laser increased the melting width and depth of the joint, and the mixing of Al and Cu was controlled in the Al-Cu mixed zone at the upper part of the weld, to limit element mixing in the Cu-rich zone of the weld interface and suppress the distribution of intermetallic compounds. In addition, the ring laser induced the aluminum in the upper part of the molten pool to invade from both sides of the interface to the bottom, forming a certain Al invasion depth. This limited the accumulation of intermetallic compounds at the interface, optimized the path of shear fracture propagation, and improved the shear strength of the joint. This study provides a research basis for further exploring the material flow mechanism and optimizing the intermetallic compound distribution during the Al-Cu adjustable ring-mode (ARM) laser dissimilar welding process.