Interfacial microstructure and reaction mechanism with various weld fillers on laser welding-brazing of Al/Cu lap joint

Zhenglong Lei,Xinrui Zhang,Jinge Liu,Peng Li

DOI: https://doi.org/10.1016/j.jmapro.2021.04.065

IF: 5.684

2021-07-01

Journal of Manufacturing Processes

Abstract:The influence of pure Al, Al-Si and Zn-Al weld fillers on microstructure and mechanical properties was investigated during lap laser welding-brazing of Al to Cu. Al4.2Cu3.2Zn0.7 IMC layer and plate-like Al2Cu phase were observed at Al/Cu interface with pure Al and Al-Si weld fillers. Microcrack was easy to generate in Al2Cu phase decreasing the joint strength. When the Zn-Al weld filler was adopted, the formation of Al2Cu brittle phase was limited by low Al content and the CuZn and CuZn5 IMC layers were observed at Al/Cu interface. According to the chemical potential, the diffusivity of Cu atoms in Zn-Al weld filler was much lower than that of pure Al and Al-Si weld fillers, which prevented from the formation of coppery phases near the Al/Cu interface. Si atoms tended to concentrate at Al/Cu interface. It played a role in obstructing the diffusion of Cu atoms, enhancing the Al/Cu joint strength to some extent. According to nanoindentation result, the mechanical property of the formed phases (CuZn and CuZn5) in the case of Zn-Al weld filler was better than that formed with pure Al and Al-Si weld fillers such as Al2Cu and Al4.2Cu3.2Zn0.7. The highest tensile strength was 148 MPa with Zn-Al weld filler.

engineering, manufacturing

What problem does this paper attempt to address?

The problem that this paper attempts to solve is the influence of different solders on the interface microstructure and mechanical properties during the laser welding - brazing process of aluminum - copper lap joints. Specifically, the interface microstructures formed during the welding process and their reaction mechanisms of three solders, namely pure aluminum, aluminum - silicon and zinc - aluminum, were studied. In particular, how these solders affect the metallurgical bonding and mechanical properties of the aluminum - copper interface was investigated, in the hope of finding a method that can effectively improve the welding strength of aluminum - copper lap joints.

### Main problem points:
1. **Difference in melting points**: The melting point of copper (1083°C) is much higher than that of aluminum (660°C), which results in severe burn - off of aluminum alloys easily in the traditional fusion welding process, while copper alloys are only partially melted.
2. **Residual stress**: Due to the large difference in the coefficient of thermal expansion between copper and aluminum alloys, huge residual stress will be formed on the aluminum - copper interface after welding.
3. **Brittle intermetallic compounds (IMCs)**: During the cooling process, brittle intermetallic compounds (such as Al₂Cu and Al₄Cu₉) are easily generated on the aluminum - copper interface, and these compounds will lead to the formation and propagation of welding cracks, seriously affecting the strength of the welding joint.

### Research methods:
- **Experimental design**: 6061 aluminum alloy and H62 copper alloy were used as base materials, and pure aluminum, aluminum - silicon and zinc - aluminum solders were respectively used for laser welding - brazing (LWB).
- **Numerical simulation**: A three - dimensional finite element model (FEM) was established to predict the thermal history of the aluminum - copper interface.
- **Thermodynamic analysis**: The enthalpy of formation and chemical potential were calculated through the Miedema model and Toop model to study the mechanism of element diffusion and interface reaction.

### Key findings:
- **Pure aluminum solder**: The formed Al₂Cu phase is prone to generate micro - cracks, reducing the joint strength.
- **Aluminum - silicon solder**: Si atoms are enriched on the aluminum - copper interface, hindering the diffusion of Cu atoms, thereby reducing the formation of Al₂Cu phase and increasing the joint strength.
- **Zinc - aluminum solder**: Due to the low Al content, the formation of the Al₂Cu brittle phase is limited, and CuZn and CuZn₅ intermetallic compound layers are formed. These compounds have good mechanical properties, making the maximum tensile strength of the joint reach 148 MPa.

Through the above research, this paper aims to provide theoretical and experimental bases for the efficient welding of aluminum - copper dissimilar materials, especially in terms of selecting appropriate solders.