Influence of Thermal Aging on the Evolution of Dielectric and Physical Properties in Resin-impregnated Paper

Jiaxuan Yan,Bo Qi,Han Zhang,Mingcheng Hua,Chuang Ma,Xiao Yang,Chengrong Li

DOI: https://doi.org/10.1109/cieec60922.2024.10583613

2024-01-01

Abstract:Resin-impregnated paper (RIP material) is a widely used internal insulation material in Ultra High Voltage (UHV) bushings, requiring high electrical insulation strength, excellent thermal stability, and long-term reliability. Understanding the complex degradation mechanisms of impregnated paper under the combined influence of thermal factors is crucial for enhancing the reliability and lifespan of such insulation systems. This study delves into the intricate degradation mechanisms affecting the insulation performance of impregnated paper under thermal stress. Through degradation experiments, impregnated paper samples with varying degradation times underwent frequency domain dielectric property testing and phase characteristic analysis. Significant degradation in the dielectric properties of the material was observed under the combined effects of electric and thermal fields, with a notable increase in dielectric and dissipation factors in the low-frequency region. Utilizing the Havriliak-Negami model, the fitting results revealed an increase in internal and interfacial polarizations under thermal stress. Fourier spectrum analysis indicated an increase in functional groups such as hydroxyl and methyl, a reduction in ether bonds, and an initial increase followed by a decrease in ester bonds. The study also employed molecular dynamics simulations to explain the material's degradation mechanism and correlated these findings with spectroscopic characteristics, elucidating the microscopic degradation process. These findings suggest molecular long-chain breakage and the generation of smaller molecules, leading to an increase in internal and interfacial polarization strength. The study demonstrates a good correlation between the phase structure evolution and dielectric performance before and after the degradation of RIP material. It unveils the degradation mechanisms of the material under the influence of thermal factors.